Resources Contact Us Home
Aaen; Peter H.
Phoenix, AZ
No. of patents:

Patent Number Title Of Patent Date Issued
8030763 Semiconductor package with reduced inductive coupling between adjacent bondwire arrays October 4, 2011
A semiconductor package (20) includes circuits (22, 24). The circuit (22) includes electrical devices (52, 54) interconnected by a bondwire array (62). Likewise, the circuit (24) includes electrical devices (58, 60) interconnected by a bondwire array (64). Signal wires (76) of the bo
7683480 Methods and apparatus for a reduced inductance wirebond array March 23, 2010
A wirebond array (100) comprising a plurality of signal wires 110 and a plurality of ground wires (120) interdigitated with and substantially parallel to the set of signal wires (110). In one embodiment, each of the plurality of signal wires (110) and ground wires (120) is attached to a

  Recently Added Patents
High throughput thin film characterization and defect detection
Pre-fetching map data using variable map tile radius
Sensor apparatus and information processing apparatus
Fuel cell stack including ejector and blower for anode recirculation and method for controlling the same
Vehicle speed verification system and method
Moving structure and micro-mirror device using the same
Soybean cultivar CL1013663
  Randomly Featured Patents
Ternstroemia gymnanthera plant named `Sotall`
Electronic noise suppressor
Amorphous copolymers of two fluorinated ring monomers
Forward swept centrifugal fan wheel
Pegboard wall-plug storage system
Fiber optic pressure sensor based on differential signaling
Display unit for firearms
Well liner with dual concentric half screens
Method for exchanging packets of user data
Interserver data association apparatus