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Aaen; Peter H.
Phoenix, AZ
No. of patents:

Patent Number Title Of Patent Date Issued
8030763 Semiconductor package with reduced inductive coupling between adjacent bondwire arrays October 4, 2011
A semiconductor package (20) includes circuits (22, 24). The circuit (22) includes electrical devices (52, 54) interconnected by a bondwire array (62). Likewise, the circuit (24) includes electrical devices (58, 60) interconnected by a bondwire array (64). Signal wires (76) of the bo
7683480 Methods and apparatus for a reduced inductance wirebond array March 23, 2010
A wirebond array (100) comprising a plurality of signal wires 110 and a plurality of ground wires (120) interdigitated with and substantially parallel to the set of signal wires (110). In one embodiment, each of the plurality of signal wires (110) and ground wires (120) is attached to a

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