Resources Contact Us Home
Method of cutting material for use in implantable medical device

Image Number 4 for United States Patent #RE42818.

A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.

  Recently Added Patents
System and method for efficient resource management of a signal flow programmed digital signal processor code
Cable exit trough with insert
Photoelectric conversion module
Television with a stand
Indicating transfer in an IMS network
Mobile communication method, mobile station, and network device
Pixel structure of organic light emitting device
  Randomly Featured Patents
Temperature sensing system for microwave oven apparatus
Polarization-modulated tip enhanced optical microscope
Combination ribbon string-up and winder apparatus
Composition for preventing formation of scales in welding
Disinfecting gas filters
Negative resists based on a acid-catalyzed elimination of polar molecules
Robotomorphic audio player
HEMT with a graded InGaAlP layer separating ohmic and Schottky contacts
Optical fiber-optical device coupling package and optical fiber-optical device module
17-beta HSD1 and STS inhibitors