Resources Contact Us Home
Method of cutting material for use in implantable medical device

Image Number 4 for United States Patent #RE42818.

A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.

  Recently Added Patents
Real-image zoom viewfinder and imaging apparatus
Lens driving device
Method for forming contact hole
Information processing apparatus and storage medium for storing information processing program
Off-loading of processing from a processor blade to storage blades based on processing activity, availability of cache, and other status indicators
Systems and methods for tracking power modulation
Techniques for image segment accumulation in document rendering
  Randomly Featured Patents
Morpholine from bis (cyanomethyl) ether
Apparatus for providing desktop mobility for desktop electronic devices
Device for producing a fluid stream of varying composition
Nemesia plant named `Intraigoldtwo`
Video disc player having record size identification apparatus
L-glutamine sensor
Method to make a vehicle door
N-Alkylsulfonyl-, N-arylsulfonyl-, and N-aminosulfonylaminosulfinylcarbamate esters
Individually-contoured seat cushion and shape capturing and fabricating method for seat cushion