Resources Contact Us Home
Method of cutting material for use in implantable medical device

Image Number 4 for United States Patent #RE42818.

A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.

  Recently Added Patents
Apparatus and method for information display of portable device
Vehicle hood
Upper surface of a skateboard deck
Method for switching between virtualized and non-virtualized system operation
Optoelectronic devices and a method for producing the same
Patterned MR device with controlled shape anisotropy
Techniques to manage communications resources for a multimedia conference event
  Randomly Featured Patents
Detection of autoantibodies reactive with pancreatic islet cell antigenic molecules and/or insulin
Vitamin D analogues
Process for making ethylene glycol
Spark-ignition engine
Method and system for remote software testing
Cool touch handle
Method for determining total cost of ownership
Surface cleaning device
Magnetically driven centrifugal pump
Fructosyl peptide oxidase