Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Multicode direct sequence spread spectrum










Image Number 14 for United States Patent #RE37802.

In this patent, we present MultiCode Direct Sequence Spread Spectrum (MC-DSSS) which is a modulation scheme that assigns up to N DSSS codes to an individual user where N is the number of chips per DSSS code. When viewed as DSSS, MC-DSSS requires up to N correlators (or equivalently up to N Matched Filters) at the receiver with a complexity of the order of N.sup.2 operations. In addition, a non ideal communication channel can cause InterCode Interference (ICI), i.e., interference between the N DSSS codes. In this patent, we introduce new DSSS codes, which we refer to as the "MC" codes. Such codes allow the information in a MC-DSSS signal to be decoded in a sequence of low complexity parallel operations which reduce the ICI. In addition to low complexity decoding and reduced ICI. MC-DSSS using the MC codes has the following advantages: (1) it does not require the stringent synchronization DSSS requires, (2) it does not require the stringent carrier recovery DSSS requires and (3) it is spectrally efficient.








 
 
  Recently Added Patents
Rapid glycopeptide optimization via neoglycosylation
Apparatus and method for encoding/decoding signal
Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
Secure data exchange between data processing systems
Secure provisioning of a portable device using a representation of a key
Respirator belt having bumper cushion
Data communication apparatus, method of controlling the same, program, and storage medium
  Randomly Featured Patents
Electronic component placement method
Method and composition for removing filter cake
Shoe outsole bottom
Fiber optic switch
Firearm sight with horizontal linear alignment indicator
Tap detection
Device for the nonlethal combating of aircraft
Tandem gauge wheel assembly for planting unit
Charge pump device and operating method thereof
Tool for semiconductor package