Resources Contact Us Home
Preventing UBM oxidation in bump formation processes

Image Number 3 for United States Patent #8609526.

A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.

  Recently Added Patents
Pharmaceutical treatment process using chitosan or derivative thereof
Email certificates
Storage system with LU-setting function
Synergistic fungicidal interactions of 5-fluorocytosine and other fungicides
Liquid crystal display backlight control
Information processing apparatus and power supply controlling method
Semiconductor device and method of manufacturing the same
  Randomly Featured Patents
Case for musical instrument
Imidazole derivatives as inhibitors of TXA.sub.2 synthesis
Method of forming bump electrode and electronic circuit device
Magnetic field production coil for nuclear magnetic resonance imaging apparatus
Kit for carrying out chemically induced fluorescence immunoassay
Circuit breaker remote service system
Combination no-back brake and torque limiter assembly
Device for a combined suction and blow-off nozzle connectable to a source of compressed air
Networked video delivery system for displaying data content and video content referenced by the data content
Television receiver