Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Methods to mitigate plasma damage in organosilicate dielectrics










Image Number 9 for United States Patent #8470706.

Methods of minimizing or eliminating plasma damage to low k and ultra low k organosilicate intermetal dielectric layers are provided. The reduction of the plasma damage is effected by interrupting the etch and strip process flow at a suitable point to add an inventive treatment which protects the intermetal dielectric layer from plasma damage during the plasma strip process. Reduction or elimination of a plasma damaged region in this manner also enables reduction of the line bias between a line pattern in a photoresist and a metal line formed therefrom, and changes in the line width of the line trench due to a wet clean after the reactive ion etch employed for formation of the line trench and a via cavity. The reduced line bias has a beneficial effect on electrical yields of a metal interconnect structure.








 
 
  Recently Added Patents
Lateral flow test kit and method for detecting an analyte
Vehicle control apparatus
Closed cell culture system
Pre-colored methodology of multiple patterning
Coating composition, and a process for producing the same
Method for radiation sterilization of medical devices
AIN buffer N-polar GaN HEMT profile
  Randomly Featured Patents
Vaccine for protection of poultry against salmonellosis and a process for preparing the same
System and method to drive display matrix
Linear motor having piezo actuators
N-[(4-heteroaryl-1-pyrrolidinyl)alkyl]-1H-benz[DE]isoquinoline-1;3(2H)-di ones and related compounds and their therapeutic utility
Method of forming a stress isolating joint on a dump body
Artificial marble using multicolor chip and method for preparing the same
Dynamic bus parking
Semiconductor light emitting device
Clock control circuit
Detecting system