Resources Contact Us Home
Semiconductor package and method of fabricating the same

Image Number 8 for United States Patent #8455992.

Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.

  Recently Added Patents
Carrier or transport strip
Wire guide
Solar cell with hyperpolarizable absorber
Hemostatic devices and methods of making same
Lightning-protective explosion-preventive fastener
Method and apparatus for determining storage capacity error for a data storage device
Author signatures for legal purposes
  Randomly Featured Patents
Method of inhibiting apoptosis
Antiphlogistic agent and its use
Hair volume brush
Catalyst system for the reduction of NO.sub.x
Cup with lid
Coating composition, hard coat film, and optical disk
Apparatus and method for improving r.f. isolation between adjacent antennas
Electrode with improved signal to noise ratio
Alternator and starter tester protection apparatus and method
Method for the contactless measurement of three-dimensional objects with two layers by single-view backlit shadowgraphy