Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package and method of fabricating the same










Image Number 7 for United States Patent #8455992.

Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.








 
 
  Recently Added Patents
System and method for supporting fibre channel over ethernet communication
Reception circuit and signal reception method
Benzimidazole inhibition of biofilm formation
Liquid formulations of carboxamide arthropodicides
Sheet coil type resolver
Use of tris(hydroxymethyl) aminomethane for the stabilization of peptides, polypeptides and proteins
Method and apparatus for soft information transfer between constituent processor circuits in a soft-value processing apparatus
  Randomly Featured Patents
Disbursing device in machine for counting paper sheets
Social network based recommendation method and system
Method of making top floating-gate flash EEPROM structure
Error diffusion using next scanline error impulse response
Integrated circuit including a surface acoustic wave transformer and a balanced mixer
Hair growth methods using FGFR3 extracellular domains
Rack for articles of clothing
Application of porous structured organic films for gas storage
Baseball game
High output loudspeaker