Resources Contact Us Home
Semiconductor package and method of fabricating the same

Image Number 3 for United States Patent #8455992.

Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.

  Recently Added Patents
Memory elements with increased write margin and soft error upset immunity
Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, and acrylic pressure-sensitive adhesive tape
3D image generating method, 3D animation generating method, and both 3D image generating module and 3D animation generating module thereof
Die packages and systems having the die packages
Information distribution system, information distributing method, node, and recording medium
Near-field optical disk having surface plasmon amplification by stimulated emission of radiation
Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same
  Randomly Featured Patents
Aperture of a nozzle assembly of an inkjet printer
Field distribution measuring method and device
Arrangement for furnishing an indication of total fare including surcharges in an electronic taximeter
Steplessly variable belt drive for bicycle
Array-based detection of genetic alterations associated with disease
Process for the preparation of 2-acylamino-6-halopurine from 2,9-diacylguanine
Time delimited multiple admission method and system
Apparatus for dispensing and compacting paper towels
Method and materials for teaching the phonetic code and repairing self esteem
System for accessing the same memory location by two different devices