Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package and method of fabricating the same










Image Number 3 for United States Patent #8455992.

Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.








 
 
  Recently Added Patents
Information processing apparatus and storage medium for storing information processing program
Fuser member
Communication network management system, method and program, and management computer
Optical scanner and image-forming device
Voltage detecting device for LED driver
Systems and methods for tracking power modulation
Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing same
  Randomly Featured Patents
Electromagnet system for influencing a dipper armature
Development material and process for the production of a negative color proof, and process for the production of both a positive and negative color proof on a single image-receiving material
Method of a robot for installing weather stripping in a door or like opening
Multiple antenna ablation apparatus and method
Drawing machine for continuous drawing of endless wires or tubes
Robotic catheter system
Method and apparatus for certifying the output torque curve of a hydraulic hoist for use in dump body applications
Fuse state indicator systems
Semiconductor memory device capable of securing large latch margin
Methacrylic resin composition for optical discs