Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package and method of fabricating the same










Image Number 3 for United States Patent #8455992.

Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side.








 
 
  Recently Added Patents
Systems, computer programs, and methods for controlling costs of a healthcare practice
Preferential selection of candidates for delta compression
Display apparatus, control method thereof, and program
Pressing mold for optical lenses and method for manufacturing glass optical lenses
Stool
Bessel beam plane illumination microscope
Fixing apparatus
  Randomly Featured Patents
Method of breakdown-forming electro-unite tubes
Method and device for securing a circuit board to a computer assembly
Stabilized air cushion vehicle
Automatic steering system for vessels with a wireless remote control and course change capability
Trailer hitch carriage
Multi-compartmental winch device
Charging apparatus
Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
Clinical tissue examination
Transparent sub-wavelength network