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Multi-chip package having frame interposer










Image Number 2 for United States Patent #8426951.

A multi-chip package is provided. The multi-chip package may include a frame interposer, a first chip stack with n number of semiconductor chips on a first surface of the frame interposer, and a second chip stack with m number of semiconductor chips on a second surface of the frame interposer. The interposer may have first and second openings. The first chip stack may extend over one of the first and second openings and may expose the other of the first and second openings. The second chip stack may extend over the other of the first and second openings and may expose the one of the first and second openings.








 
 
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