Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same










Image Number 8 for United States Patent #8420524.

Void boundary structures, semiconductor devices having the void boundary structures, and methods of forming the same are provided. The structures, semiconductor devices and methods present a way for reducing parasitic capacitance between interconnections by forming a void between the interconnections. The interconnections may be formed on a semiconductor substrate. An upper width of each of the interconnections may be wider than a lower width thereof. A molding layer encompassing the interconnections may be formed. A void boundary layer covering the molding layer may be formed to define the void between the interconnections.








 
 
  Recently Added Patents
Stable file system
Wideband antenna
Single-chain variable fragment (scFv) able to recognize and bind CD99 human protein
Cross-platform cloud-based map creation
Nuclear fuel assembly bottom nozzle
System and method for producing statistically valid assay means and ranges for quality control materials
Session transfer method, application server, and communications system
  Randomly Featured Patents
Haptic interface handle with force-indicating trigger mechanism
Hard facing chromium-base alloys
Low cost vehicle electrical and electronic components and systems manufactured from conductive loaded resin-based materials
Polishing apparatus and method for forming an integrated circuit
Grouping and displaying of contextual objects
Amelanchier Autumn brilliance
Wrapping material for photographic light-sensitive material
Motor/encoder assembly for tape drives
Method of determining abnormality of nozzles in imaging apparatus; imaging apparatus; electrooptic device; method of manufacturing electrooptic device; and electronic equipment
Process for producing 3-chloromethyl-3-cephem derivatives