Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Void boundary structures, semiconductor devices having the void boundary structures and methods of forming the same










Image Number 8 for United States Patent #8420524.

Void boundary structures, semiconductor devices having the void boundary structures, and methods of forming the same are provided. The structures, semiconductor devices and methods present a way for reducing parasitic capacitance between interconnections by forming a void between the interconnections. The interconnections may be formed on a semiconductor substrate. An upper width of each of the interconnections may be wider than a lower width thereof. A molding layer encompassing the interconnections may be formed. A void boundary layer covering the molding layer may be formed to define the void between the interconnections.








 
 
  Recently Added Patents
Peptide vectors
Surface-emitting laser light source using two-dimensional photonic crystal
File management apparatus and file management apparatus controlling method
Buffer pool extension for database server
Nitrogen-doped carbon-supported cobalt-iron oxygen reduction catalyst
Fabricated leaf tea products
Photoelectric conversion module
  Randomly Featured Patents
Canoe portaging thwart
Resealable food container with tamper-evident indicator
Recovery of hydrocarbon values from low organic carbon content carbonaceous materials via hydrogenation and supercritical extraction
Holder for printing head frame
Flap valve
Camera with visual axis detecting device
Apparatus for recording a count signal in a fixed location regardless of transport velocity of record carrier
Methods of repairing field-effect memory cells in an electrically erasable and electrically programmable memory device
Catalyst for the generation of CO-free hydrogen from methane
Cleaning compositions containing biostatic agent