Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Enhanced adhesion of PECVD carbon on dielectric materials by providing an adhesion interface










Image Number 5 for United States Patent #8415257.

Amorphous carbon material may be deposited with superior adhesion on dielectric materials, such as TEOS based silicon oxide materials, in complex semiconductor devices by applying a plasma treatment, such as an argon treatment and/or forming a thin adhesion layer based on silicon dioxide, carbon-doped silicon dioxide, prior to depositing the carbon material. Consequently, the hard mask concept based on amorphous carbon may be applied with an increased degree of flexibility, since a superior adhesion may allow a higher degree of flexibility in selecting appropriate deposition parameters for the carbon material.








 
 
  Recently Added Patents
Water purification using energy from a steam-hydrocarbon reforming process
Drive coil, measurement probe comprising the drive coil and methods utilizing the measurement probe
UV liquid treatment system
Variable speed traffic control system
Data processing apparatus, activation control method, and computer-readable storage medium
Method and apparatus for compensating QoS during handover by base station in wireless broadband access system
Method of preparing enteric hard capsule and enteric hard capsule prepared thereby
  Randomly Featured Patents
High density high reliability memory module with power gating and a fault tolerant address and command bus
Controlled environment thermal image detection system and methods regarding same
Bottle
Dispensing nozzle, gun and filter and method using visual identifiers for orifice size and engagement dimension
Washable underpad and method for producing an underpad of this type
Z-compression mechanism
Method of making electrical contact material
Method for tissue regeneration
System and method for water purification
Inductor structure