Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Mounting structure and motor Image Number 6 for United States Patent #8411455. A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn--Ag--Bi--In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from -40 to 150.degree. C. has been suppressed.       Recently Added Patents Buckle Adjustable draw bar for trailer hitches Motor with power-generation coil module High-speed comparator with asymmetric frequency response Separate matching models based on type of phone associated with a caller Systems and methods for detecting and rejecting defective absorbent articles from a converting line Navigation device, navigation method, and navigation program   Randomly Featured Patents Image compensation apparatus Drive roller unit Apparatus and method for electromagnetic treatment of plant, animal, and human tissue, organs, cells, and molecules Line projector lens Intermediate alcohol compound Adhesive tape dispenser Vertical cells for the continuous electrodeposition of metals at high current density Compact detergent compositions with high activity cellulase Method and composition for treating thrombosis Inside/outside scribe © 2006-2008 PatentGenius. All Rights Reserved.