Resources Contact Us Home
Mounting structure and motor

Image Number 4 for United States Patent #8411455.

A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn--Ag--Bi--In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from -40 to C. has been suppressed.

  Recently Added Patents
Organic light-emitting display with black matrix
Ignition device in particular for an internal combustion engine, and method for manufacturing same
Adjustable high precision surveying device
Reframing circuitry with virtual container drop and insert functionality to support circuit emulation protocols
Tailoring the band gap of solar cells made of liquid silane by adding germanium
Methods for testing OData services
Neurophysiological central auditory processing evaluation system and method
  Randomly Featured Patents
Method for bonding powder metallurgical parts
Method for manufacturing a cooling drum for a continuous casting system
Manually operated agitator for thixotropic suspensions
Novel dyes, their preparation and use
Fabric treatment article with pattern
Device for golf practicing
Organic light emitting display device
Compositions and methods for providing a protein to a virion
Pastry forming and cutting utensil