Resources Contact Us Home
Terminal fitting

Image Number 13 for United States Patent #8403714.

It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal (20) via a nickel plating layer (21) in a terminal contact portion (11) to be held in contact with a mating terminal. A tin plating layer (23) is formed on the base metal (20) without via the nickel plating layer (21) in a wire crimping portion (12) to be crimped and connected to a core (15) of an insulated wire (14).

  Recently Added Patents
RFID reader revocation checking using low power attached displays
Cantilever of scanning probe microscope and method for manufacturing the same, method for inspecting thermal assist type magnetic head device and its apparatus
Hard disk drives having different rotational speeds
Combination for composite layered chip package
Control unit including a computing device and a peripheral module which are interconnected via a serial multiwire bus
Anti-phishing system and method
  Randomly Featured Patents
Remote siren for an alarm system
Key ring holder
Mattress having an internal fluid containing chamber
Illumination apparatus for microscope and microscope
Method for coating inner surfaces of equipment
Inverter circuit and lamp control apparatus having the same
Hairdo pattern selecting system
Irrigation and aspiration handpiece
Electrostatically operated tunneling transistor
Holding structure for holding a member in an external cabinet