Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Active area bonding compatible high current structures










Image Number 9 for United States Patent #8274160.

A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.








 
 
  Recently Added Patents
Sub-resolution assist feature repair
Compositions and methods for lowering triglycerides in a subject on concomitant statin therapy
Rose plant named `ESM R044`
Utilizing virtually stored media snapshots for rasterizing print jobs
Biaxially oriented hydrolysis-stable polyester film comprising epoxidized fatty acid derivatives and a chain extender, and process for production thereof and use thereof
Community profiling for social media
Repeating frame battery with joining of cell tabs via welded-on male and female slip-fit connectors
  Randomly Featured Patents
Powder coatings of vinylidene fluoride/hexafluoropylene copolymers
Cash processing system for automatically performing cash handling operations associated with banking services
Method and device for self-diagnosis of final setting members
Direct injection internal combustion engine
Connecting apparatus for data transmission between stackable hubs
Liquid silicone rubber coating composition, curtain airbag and making method
Booting mechanism for FPGA-based embedded system
Weir gate assembly
Wall-mounted microwave oven
Optical information recording method