Resources Contact Us Home
Active area bonding compatible high current structures

Image Number 8 for United States Patent #8274160.

A method of forming a semiconductor structure is provided. One method comprises forming a device region between a substrate and a bond pad. Patterning a conductor between the bond pad and the device region with gaps. Filling the gaps with insulation material that is harder than the conductor to form pillars of relatively hard material that extend through the conductor and forming an insulation layer of the insulation material between the conductor and the bond pad.

  Recently Added Patents
Horizontal aggregations in a relational database management system
Multi-function wrench for a power tool
Liquid crystal display device and driving method thereof
Pyrazole kinase modulators and methods of use
Transfer device and image forming apparatus including regulation member
Hermetically sealed atomic sensor package manufactured with expendable support structure
  Randomly Featured Patents
Combination tether and locking device
Finely divided aluminoxane, process for producing same and its use
Method of diagnosis of lyme disease
Earth working sweep
Method for solubilization of aspartame in effervescent aqueous systems; and composition
Image sensor device using thin film light source arranged light receiving elements and image to be sensed
Electrochemical gas sensor
Tailgate receiver and table with chairs combination
Method and apparatus for rapid automatic engagement of a probe