Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor device and manufacturing method thereof










Image Number 14 for United States Patent #8198674.

To provide a semiconductor device including a first silicon pillar, an interlayer dielectric film provided on an upper surface of the first silicon pillar and having a through-hole filled with a conductive material, and a first-diffusion-layer contact plug provided on an upper-side opening of the through-hole. An area of a lower-side opening of the through-hole is equal to an area of the upper surface of the first silicon pillar, and an area of the upper-side opening of the through-hole is larger than the area of the lower-side opening of the through-hole. With this configuration, an area of a contact surface between the conductive material within the through-hole and the first-diffusion-layer contact plug is larger than the area of the upper surface of the first silicon pillar.








 
 
  Recently Added Patents
System and method for distributed security
Maize variety hybrid X13A495
Systems, methods, and apparatus to prepare a mobile device for provisioning
Systems and methods of device-free motion detection and presence detection
Vending machine
Asynchronous task execution
Optoelectronic semiconductor chip and method for manufacturing a contact structure for such a chip
  Randomly Featured Patents
System for recovering resources from sludge
Combination antenna
Hand-held and operated seeder apparatus
Power boat
Integrated in-plane switching
Cantilever on cantilever structure
Equipment handling system
Method and apparatus to provide multimedia service using time-based markup language
Method of providing electric current taker for support bar, and support bar
Patterning methods for fabricating semiconductor devices