Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Printed circuit board assembly and connecting method thereof










Image Number 14 for United States Patent #8197284.

Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.








 
 
  Recently Added Patents
Pressure roller and fixing device equipped with the same
Charge pump circuit and power-supply method for dynamically adjusting output voltage
Statistical identification of instances during reconciliation process
Hydroxyl-terminated thiocarbonate containing compounds, polymers, and copolymers, and polyurethanes and urethane acrylics made therefrom
System and methods for obstacle mapping and navigation
Surface modification
Image reading apparatus
  Randomly Featured Patents
Environmentally compatible hydraulic fluid
Method and device for registration and immobilization
Method for making shaped silicon-silicon carbide refractories
Stabilized middle distillate fuel composition
Method of manufacturing a vehicle pull handle assembly
Multiple display pointers for computer graphical user interfaces
Time divisional duplex (TDD) system portable telephone relay device
Circuit to efficiently handle data movement within a cache controller or on-chip memory peripheral
Semiconductor device including MISFET having internal stress film
System for creating, reading and writing on rotatable information storage media, an apparatus for multilayer laser source positioning