Resources Contact Us Home
Methods and systems for providing vehicle information

Image Number 2 for United States Patent #8135506.

In an exemplary embodiment a system provides vehicle information to an operator of a vehicle having a plurality of components. The system comprises an onboard database configured to store vehicle-specific data and behavior-specific data and an operator interface. The system includes an onboard processor coupled to the onboard database, the plurality of components, and the operator interface. The onboard processor is configured to provide requested vehicle-specific data to the operator in response to an operator request via the operator interface. The onboard processor is also configured to receive operator-behavioral data from the plurality of components, recognize patterns of operation from the operator-behavioral data, and provide the behavior-specific data to the operator in response to the recognized patterns in the operator-behavioral data.

  Recently Added Patents
White light emitting diode (LED) lighting device
Brushless motor drive apparatus and drive method
Resist underlayer film forming composition for lithography, containing aromatic fused ring-containing resin
Sericin cationic nanoparticles for application in products for hair and dyed hair
Method and device for generating low-jitter clock
Access control method, information display device using the same, and information display system
Mobile device mode control based on dual mapping of availability (presence) information
  Randomly Featured Patents
Naphthyloxy acetic acids and related compounds
Connector insertion sensing structure
Process for preparing 3,4,6-trifluorophithalonitrile
Walk-in automatic teller building
Servo loop control for a coriolis rate sensor dither drive
Engine control system
Aqueous nitroglycerin injection and manufacturing process
Microcomposite of metal carbide and ceramic particles
Closed channel structural member having internal reinforcement for vehicle body and frame assembly
Stratified underfill in an IC package