Image Number 15 for United States Patent #8134228.
A voltage generated in any of a plurality of semiconductor chips is supplied to another chip as a power supply voltage to realize a stable operation of a semiconductor device in which the semiconductor chips are stacked in the same package. For example, two chips are stacked with each other, first to third pads are disposed along corresponding sides of the respective chips, which are arranged close and in parallel to each other, and these pads are commonly connected to each other with first to third metal wires respectively. In another example, fourth and fifth pad are disposed along a side different form a side along which the first to third pads are disposed, and further connected to each other with a fourth metal wire directly between the chips.
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