Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Mounting objects on a turntable










Image Number 6 for United States Patent #8132197.

The embodiments herein describe an apparatus and method for a reduced Z stack slot loading optical disc drive (ODD). In one embodiment, an optical disc mounting assembly can be used to chuck an optical disc to a turntable. The optical disc mounting assembly can include a hub spring for spring loading a hub and a clamping mechanism pivotally connected to the hub. In the described embodiment, in an extended position, the clamp is used to secure the optical disc to the turntable. The clamping mechanism can include a clamp pivotally attached to the hub at a pivot point. In the absence of the optical disc, the clamp is retracted and secured within a recess in the optical disc mounting assembly. In the presence of the optical disc, the mounting assembly chucks the optical disc to the turntable using the clamp and hub.








 
 
  Recently Added Patents
Method and system to isolate memory modules in a solid state drive
System and method for automatic decommissioning of network participants by closing select circuits in order to change a plurality of mechanical states of the network participants
Method and apparatus for traffic management in a wireless network
Method of manufacturing liquid ejection head
Ether-based reactive plasticizer for plastic bonded explosives
Massager with flexible handle and connection member
Redox shuttle for high voltage lithium battery
  Randomly Featured Patents
Acoustic imaging systems adaptable for use with low drive voltages
m-carbazolylphenyl compounds
Semiconductor substrates using bandgap material between III-V channel material and insulator layer
Field kit for detecting ciguatoxin contamination in fish
Tire repair tool means
Metal finishing barrel cover locking system
Electric shaver
Colored enamel composition for obtaining decorative layers of float glass sheets
Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
Method of bonding fluororesin films, and fluororesin film