Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Package carrier










Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.








 
 
  Recently Added Patents
Power collecting device, power measuring device, and power collecting method
Scalable encoding apparatus, scalable decoding apparatus, scalable encoding method, scalable decoding method, communication terminal apparatus, and base station apparatus
Side portion of a circular saw blade
Rotating sunlight/light beam for fractional/beneficial use
Solid-state image capture device and image capture apparatus
System and method for customized prompting
Fixture for camera attachments
  Randomly Featured Patents
Semiconductor memory and method of fabricating the same
Golf shoe removable sole covering
Encryption and decryption method and apparatus
Fire alarm system
Guiding device for brake pad supports of a spot-type disc brake
Unit cell for solid polymer electrolyte fuel cell
Reducing blocking effects in block transfer encoders
Method for determining ion concentration and energy of shallow junction implants
Paper having a melt-stable lactide polymer coating and process for manufacture thereof
Fishing line board