Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Package carrier










Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.








 
 
  Recently Added Patents
ZnO green luminescent material and its preparation
Method and device for accessing the documentation of an aircraft according to alarms generated therein
Image processing apparatus, image registering method, program causing computer to execute image registering method, and recording medium in which program is recorded
Silicone hydrogel, lens for eye and contact lens
Clostridium chauvoei polypeptide, DNA encoding the polypeptide and a vaccine comprising the polypeptide
Electric power steering apparatus
Air driven alternators for battery powered vehicles
  Randomly Featured Patents
Flow control technique for assay devices
Burst jammer erasure circuit for spread spectrum receivers
Magnetic stamp pad applicator
Panel clamp
Keyboard with cursor control
Vehicular component adjustment system and method
Poly(tetramethylene dibromoterephthalate) yarns
Communications system having redundant channels
Compositions useful as binders for the production of composite materials
Vacuum bottle