Resources Contact Us Home
Package carrier

Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.

  Recently Added Patents
Tetrazolyl oxime derivative, salt thereof, and plant disease control agent
Method and system for testing indirect bandgap semiconductor devices using luminescence imaging
Collaborative system for capture and reuse of software application knowledge and a method of realizing same
Receiver with feedback continuous-time delta-sigma modulator with current-mode input
Encoding digital content based on models for predicting similarity between exemplars
Profiled rail for advertising/display units
  Randomly Featured Patents
Electrical plug and socket having replaceable overcurrent protection device with safety latch means
Hydrogen absorbing alloy electrodes and nickel-metal hydride batteries using the same
Water sprayer
High capacity extrusion die assembly
Laser amplifier power extraction enhancement system and method
Process for slurry polymerization of propylene oxide with high catalyst efficiency
PBX networking with quality of service control
High power allngan based multi-chip light emitting diode
Web page fact checking system and method