Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Package carrier










Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.








 
 
  Recently Added Patents
Direct chemical vapor deposition of graphene on dielectric surfaces
Generation, display, and manipulation of measurements in computer graphical designs
Tablet computer
Method for measuring and improving organization effectiveness
Low cost mesh network capability
Motion-compensated prediction of inter-layer residuals
Victim port-based design for test area overhead reduction in multiport latch-based memories
  Randomly Featured Patents
Strontium aluminate inorganic fibers
Arrangement of measuring devices on a semitrailer motor vehicle
Therapeutic particles suitable for parenteral administration and methods of making and using same
Differential pressure transducer utilizing a variable ferrofluid keeper as an active magnetic circuit element
Photochromic optical article
Apparatus for attaching a surface mount component
Outdoor receiver system of a mobile communication base station
Processes for producing carbamates and isocyanates
Method for producing refrigerated ground flesh of fish of high elasticity
Mold protection device