Resources Contact Us Home
Package carrier

Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.

  Recently Added Patents
System and method for controlling a wireless device
Energy storage device package
Method and apparatus for web crawling
Selection of a suitable node to host a virtual machine in an environment containing a large number of nodes
Integrated circuit packaging system with an encapsulation and method of manufacture thereof
Method and device for detecting the dysfunction of a gas pressure sensor in a vehicle tire
Nuclear fuel assembly bottom nozzle
  Randomly Featured Patents
Speed control of a D.C. electric motor
Method and plate apparatus for dew point evaporative cooler
MN gene and protein
Amphipathic peptides
Device for measuring the pressure of a liquid and method for regulating such a device
Color difference display control apparatus, color difference display control method, and control program
System for addressing a data storage unit used in a computer
Soccer training device
Gelled biopolymer based foam
Tread band with grooves provided with a noise-reducing device