Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Package carrier










Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.








 
 
  Recently Added Patents
Methods circuits apparatuses and systems for facilitating access to online content
Jet pump and reactor
Method and system for efficient DRX operation during handover in LTE
Geo-coding images
Composite materials comprising aggregate and an elastomeric composition
Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
Computer program, system, and method for mapping Social Security claiming strategies
  Randomly Featured Patents
Universal bit holder block connection surface
Fluorescence polarization assay
Flexible traffic reflector
Double-heterostructure semiconductor with mesa stripe waveguide
Truck cab
Optical bar code reader
IC chip error detecting and correcting method
Process for the production of mouldings
Multi-camera closed circuit television system for aircraft
Cigarette-lighter holder