Resources Contact Us Home
Package carrier

Image Number 10 for United States Patent #8130509.

A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer.

  Recently Added Patents
Wafer level packaging
Pre and post-paid real time billing convergence system
Apparatus and method for transferring a data signal propagated along a bidirectional communication path within a data processing apparatus
Light-emitting diode devices
Vehicle, toy, and/or replicas thereof
Heating pad
Methods of reverse link power control
  Randomly Featured Patents
Co-processing solid biomass in a conventional petroleum refining process unit
Apparatus for computing transcendental functions quickly
Covering structure intended especially to be placed on a conduit or the like laid on the ocean floor
Bonding silicon wafers
Receiver for performing position location with efficient rotator
Repository for drive-through service windows
Hydrotherapy spa
Process for the preparation of multinuclear aromatic polyamines
Computer-aided fabrication of a removable dental prosthesis
Sole element for a shoe