Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Lubricant composition and antioxident composition
Process for brominating unsaturated organic compounds with removal of quaternary ammonium or quaternary phosphonium monochlorides
Modular storage system
Printable and printed articles
System and method of verification of analog circuits
Therapeutic vitamin D sun-protecting formulations and methods for their use
Triple-action pest control formulation and method
  Randomly Featured Patents
Deformable mirror with pneumatic actuator pre-load
Immunoassay apparatus
Whitening embellisher
Method and apparatus for performing a comparison of given patterns, in particular fingerprints
Antimicrobial catheter
Recording medium having a data structure for managing a data stream recorded on the recording medium and recording and reproducing methods and apparatuses
Catalyst and process for the polymerization of alpha-olefins
Optical head, optical information recording and reproducing device, and optical information system device
Deactivation resistant photocatalysts
Heavy-duty garment hanger