Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor chip assembly with post/base heat spreader and plated through-hole










Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.








 
 
  Recently Added Patents
Packaging
Method and apparatus of communication using soft decision
Turbulence sensor and blade condition sensor system
Flat panel display device and stereoscopic display device
Lens module and method for manufacturing thereof
Reactor core of liquid metal cooled reactor
Solid-state image sensing apparatus and electronic apparatus
  Randomly Featured Patents
Optical beam scanning apparatus
Process for producing expanded article of thermoplastic resin
Convertible container and vehicle
Instrument for positioning an X-ray camera in dental X-ray photography
Transdermal delivery devices
Retractable label
Method for adjusting center frequency and bandwidth of monolithic filters by plating through a single-aperture mask on a single side of the filters electrode pattern to plate selected areas of
Scroll machine with reverse rotation protection
Solid state temperature responsive switch
Method and apparatus for double-talk detection in a hands-free communication system