Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor chip assembly with post/base heat spreader and plated through-hole










Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.








 
 
  Recently Added Patents
Method and system for establishing security connection between switch equipments
Method and system for providing geohazard information to customers
Live-attenuated compositions for bacterial infections
Mass spectrometry device and method using ion-molecule reaction ionization
Recovering a database to any point-in-time in the past with guaranteed data consistency
Method for drug screening and characterization by calcium flux
Wireless communications system, wireless communications apparatus, wireless communications method and computer program for wireless communication
  Randomly Featured Patents
CD changing device
Pump dispenser for lotions and/or large doses of product
Optoelectronic devices
Method and apparatus for generating error correction data, and a computer-readable recording medium recording an error correction data generating program thereon
Expandable plug for drain pipes
System and method for adjacent channel power detection and dynamic bandwidth filter control
Apparatus for assisting in fluid removal from fluid storage bladder and the like
Power line carrier controlled lighting system
Functionalized phenolic esters and amides and polymers therefrom
Electronic watch module and its method of fabrication