Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Anti-proliferative and anti-inflammatory agent combination for treatment of vascular disorders with an implantable medical device
Lubricant supplying device, process cartridge, and image forming apparatus
System and method for broadcasting rich media to devices over multiple carriers
Remedy for overactive bladder comprising acetic acid anilide derivative as the active ingredient
Dual work function recessed access device and methods of forming
Myoglobin blooming agents, films, packages and methods for packaging
Systems and methods for providing a collaboration place interface including data that is persistent after a client is longer in the collaboration place among a plurality of clients
  Randomly Featured Patents
Single semiconductor wafer processor
Seat base
Process for decreasing the rate of titanium corrosion
Method and apparatus for orienting image representative data
Method of switching modes of a computer operating in a grid environment based on the current operating mode
Rotor hub vibration attenuator
Apparatus for pipeline stabilization and shoreline erosion protection
System and method for detecting mask data handling errors
Hydrazine compounds usesful as pesticides
Model plane flight control