Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Direct converting apparatus, method for controlling the same, and control signal generation device
Plants and seeds of hybrid corn variety CH450823
Decontamination apparatus and method
Pixel circuit
Sensing device and electronic apparatus
Related news articles
Charge domain filter and method thereof
  Randomly Featured Patents
Journaled data backup during server quiescence or unavailability
Surface mount fluorescent strip light fixture retrofit kit and method
Methods of producing PVA hydrogel implants and related devices
Variable air volume system including BTU control function
Methods and apparatus for creation and transport of multimedia content flows
Television tuning system
Introducer sheathe with electrodes
Bucket position indicator assembly
Roll grooving apparatus