Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
Reserving a time block in a calendar application to account for a travel time between geographic locations of appointments
FET device having ultra-low on-resistance and low gate charge
3,7-diamino-10H-phenothiazine salts and their use
Orthogonal tunable antenna array for wireless communication devices
Techniques to manage communications resources for a multimedia conference event
Method of bonding metallic members, and metallic bonded body
  Randomly Featured Patents
Multi-layer capacitor
Dental implant having a recessed surface for sealing
Allergen absorbent and blocking aerosol composition
Hydroxycarbonylphenyl substituted 4-(aminomethyl)-piperidine benzamides as 5HT.sub.4 antagonists
Raised wall isolation device with spacer isolated contacts and the method of so forming
Aminopyrrolidine sulfonamides as serine protease inhibitors
Proteinaceous compositions having an activity on erythropoiesis
Inflatable emergency shelter
Adjustable single lock gutter broom mechanism
Radiator cap remover