Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Method for olympic event hospitality program management
Wideband multi-channel receiver with fixed-frequency notch filter for interference rejection
Detecting the type of NAT firewall using messages
Golf club cover
Digital photographing apparatus and control method for evaluating validity of an auto-focus operation
Sharing networks determined by sharing of items between individuals
Vending machine
  Randomly Featured Patents
System and method that routes flows via multicast flow transport for groups
Lever system for actuating a clutch
Total knee arthroplasty method
Holder for a tissue box
Hydraulic forward/reverse shift fork control for a power transmission
Film supply system for using with a photosensitive film imager
Object model for Java
Heated cartridge humidifier and humidification chamber for use therewith
Touch sensing apparatus using varying signal delay input to a flip-flop
Absolute pressure transducer and method for making same