Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
AC/DC converter
Scaleable status tracking of multiple assist hardware threads
Network based JIT on a priori knowledge of a set of disparate clients
Chair structure
System and method for confirming delivery of an electronic message
Virtual appliance update method
Video-recording reservation management apparatus, method, program, and system
  Randomly Featured Patents
Corrosion inhibition
Wearable artificial pancreas
Stabilized lubricant compositions
Deck hinge
Electrochemical cell having a multiplate electrode assembly housed in an irregularly shaped casing
Test tray positioning stopper mechanism for automatic handler
Preparation of 9-(Z)-retinoic acid
Auxiliary-gas supplying apparatus for combustion engine
Leg rest for a seat, notably for an aircraft
Precision correction of reflectance measurements