Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Configurations and methods for effluent gas treatment
Rechargeable battery including a channel member
Printing apparatus and method of operation of a printing apparatus
Print control server, print controlling method, and print control program
Digital display
Multi-carrier operation for wireless systems
  Randomly Featured Patents
Elongate bi-lithic printhead with a support member
Coil adapter reel
Jewelry display support, or similar article
Rotary stone cutting method
Crystalline solvate of cefuroxime acid
Door stop
Soft contact lens preserving solutions
Anti-theft device for the steering column of a motor vehicle
Applicator for coating traveling webs and coating process
Octagon bottle