Resources Contact Us Home
Semiconductor chip assembly with post/base heat spreader and plated through-hole

Image Number 13 for United States Patent #8129742.

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole.

  Recently Added Patents
Autonomous adaptation of transmit power
Frequency offset estimation apparatus and method of OFDM system
Protective vest
Light-emitting device package structure
Method for switching channels in a wireless communication network
Luggage cart
Fuel cell system, and electric vehicle equipped with the fuel cell system
  Randomly Featured Patents
Probe cover detaching mechanism and ear type clinical thermometer
Finisher with a stapler
Circuit for providing a reference voltage
Manufacturing of xylitol using recombinant microbial hosts
Circuit system for preventing measuring device from being erroneously operated
Waste treatment unit
Method for verifying the filling level of coal in a ball mill
Multi-spectral infrared super-pixel photodetector and imager
Analog fax and modem requests in a D-AMPS multi-line terminal system
Method and apparatus for providing control of background video