Resources Contact Us Home
Semiconductor package and method of forming the same

Image Number 6 for United States Patent #8129221.

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

  Recently Added Patents
Human renal disease marker substance
Methods and apparatus for address translation functions
Active and progressive targeted advertising
Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and electronic apparatus
Wireless subscriber managing storage of HARQ packets
Reduced plating ignitron
Package for product
  Randomly Featured Patents
Redundancy in packet routing devices
Method for fabricating light emitting diode chip
Permutation mapping for ARQ-processed transmissions
Print-head positioning system having a paper sensor
Semiconductor device and method for manufacturing
Slide retainer for injection molds
Vacuum carburizing with unsaturated aromatic hydrocarbons
Orthogonal frequency division multiplexing (OFDM) receiver used in wireless local area network system and symbol timing synchronization method therefor
Wafer prober having sub-micron alignment accuracy