Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package and method of forming the same










Image Number 6 for United States Patent #8129221.

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.








 
 
  Recently Added Patents
Determining system for localization methods combination
Push-up bar
Method and system for cooling of integrated circuits
System and method for judging success or failure of work of robot
Serving base station selection based on backhaul capability
Method for enhanced subsurface electromagnetic sensitivity
Plants and seeds of hybrid corn variety CH089600
  Randomly Featured Patents
Conveyor apparatus
Estimation of the configuration of an optical element for an optical writing device
Method of coating semiconductor substrates
Reflection-detector sensor position indicator
Healthcare system planning tool
Method for manufacturing an oxide superconducting article
Yarn limiting disc device
Static content addressable memory cell
Device for influencing a laser beam
Lane-keep control system for vehicle