Resources Contact Us Home
Semiconductor package and method of forming the same

Image Number 6 for United States Patent #8129221.

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

  Recently Added Patents
Method, apparatus, and system for energy efficiency and energy conservation including dynamic cache sizing and cache operating voltage management for optimal power performance
Fire detector
Thwarting keyloggers using proxies
Method for driving electrophoretic display device, electrophoretic display device, and electronic device
Systems and methods for selective text to speech synthesis
Optical modulator module
Imidazolidine-2,4-dione derivatives, and use thereof as a cancer drug
  Randomly Featured Patents
Dual powered full suspension tricycle
Method and apparatus for control of an upstream water level
Audio-visual teaching machine for speedy training and an instruction center on the basis thereof
Vapor phase epitaxial growth of carbon doped layers of Group III-V materials
Apparatus for conveying food products of varying sizes
Performance lateral double-diffused MOS transistor
Keyed noise filter in a television receiver
Fluid-operated striker assembly with automatic stroke length variation
Heat sensitive paper
Method for specific silencing of genes by DNA methylation