Resources Contact Us Home
Semiconductor package and method of forming the same

Image Number 6 for United States Patent #8129221.

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

  Recently Added Patents
Detachably integrated battery charger for mobile cell phones and like devices
Computer network running a distributed application
Liquid crystal display
Canine iPS cells and method of producing same
Method for testing multi-chip stacked packages
Solid-state imaging apparatus, method of manufacturing solid-state imaging apparatus, and electronic apparatus
Multi-level integrated circuit, device and method for modeling multi-level integrated circuits
  Randomly Featured Patents
Method for fastening a holding bar to a printing blanket
Fluorocarbon group-containing organosilane compound
Epoxy resin composition, process for providing latency to the composition and a semiconductor device
Reclosable bag with profile strip fastener assembly, and bag body
Heat sink fastener for an electronic device
Lift and tilt station for a covering for an architectural opening
Combined preparations with vascular effect containing dihydropyridines acetylsalicylic acid nitroesters and vitamins
Thermally efficient multiple stage gear pump
Cooking control circuit for cooking range