Resources Contact Us Home
Semiconductor package and method of forming the same

Image Number 6 for United States Patent #8129221.

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

  Recently Added Patents
Method and apparatus for soft information transfer between constituent processor circuits in a soft-value processing apparatus
OFDM control signaling in the presence of timing asynchronization in a peer-to-peer network
Systems and methods for providing live voicemail to a mobile handset
Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly
Method of preparing highly fluorinated carboxylic acids and their salts
Apparatus with a local timing circuit that generates a multi-phase timing signal for a digital signal processing circuit
Escalating data backup protection in response to a failure in a cluster of nodes
  Randomly Featured Patents
Water-in-oil emulsion explosive
Optical pickup device
Toy make-up center
Collapsible member
Adjustable perforating roller for sheet material
Image pickup device
Beam steering with a slot array
Networked software development environment allowing simultaneous clients with combined run mode and design mode
Method for removing harmful components from a gaseous mixture