Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor package and method of forming the same










Image Number 6 for United States Patent #8129221.

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.








 
 
  Recently Added Patents
Mobile terminal apparatus, radio base station apparatus and radio communication method
Light source lighting device including a constant-current supply that is connected to a light source and supplies a constant current of a substantially constant magnitude to the light source,
Inspection systems and methods for detecting defects on extreme ultraviolet mask blanks
Methods and devices for multiple-mode radio frequency synthesizers
Sweetener compositions having enhanced sweetness and improved temporal and/or flavor profiles
Organic EL display device and method for manufacturing the same
Mirac proteins
  Randomly Featured Patents
Semiconductor layout structure for ESD protection circuits
Quantization matrix adjusting method for avoiding underflow of data
Refrigerator mullion
Color image processing method and apparatus
Microwave oven
Coaxial vapor recovery nozzle
Organic light emitting devices having carrier transporting layers comprising metal complexes
Layout verifying method for integrated circuit device
LED lighting
Phlox plant named `Pina Colada`