Resources Contact Us Home
Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Image Number 12 for United States Patent #8129219.

In a semiconductor module where a metal sheet, an insulating layer and a circuit element are stacked in a manner that the insulating layer is penetrated with a bump structure, the connection reliability of the bump structure and the circuit element is enhanced. A semiconductor wafer is prepared where a semiconductor substrate having electrodes and protective film on the surface are arranged in a matrix shape. On the surface of the semiconductor substrate, an insulating layer is held between the substrate and a copper sheet, integrally formed with bumps, having grooves in the vicinity of the bumps. The semiconductor substrate, the insulating layer and the copper sheet are press-bonded by a press machine into a single block. The bump penetrates the insulating layer, and the bump and the electrode are electrically connected together. An extra part of the insulating layer pushed out by the bump flows into the groove.

  Recently Added Patents
Image signal processing apparatus and image signal processing method
Analog to digital converter with increased sub-range resolution
Method and system for imaging a cross section of a specimen
High porosity ceramic honeycomb article containing rare earth oxide and method of manufacturing same
Device to control force required to depress accelerator pedal
Printed circuit board including electromagnetic bandgap structure
Methods, systems, and media for swapping faces in images
  Randomly Featured Patents
Milling tool with overlapping inserts
Method of forming minimally spaced word lines
Connector for terminating flexible parallel conductors
Vinyl acetate-ethylene carpet backings having spill resistance
Two-dimensional phase element and method of manufacturing the same
Electrical toggle switch lever extender
Adjustable stop apparatus for register punch
Access control list endpoint implementation
Printed circuit embedded capacitors
Multiplex housing with central and peripheral dwelling units