Resources Contact Us Home
Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Image Number 12 for United States Patent #8129219.

In a semiconductor module where a metal sheet, an insulating layer and a circuit element are stacked in a manner that the insulating layer is penetrated with a bump structure, the connection reliability of the bump structure and the circuit element is enhanced. A semiconductor wafer is prepared where a semiconductor substrate having electrodes and protective film on the surface are arranged in a matrix shape. On the surface of the semiconductor substrate, an insulating layer is held between the substrate and a copper sheet, integrally formed with bumps, having grooves in the vicinity of the bumps. The semiconductor substrate, the insulating layer and the copper sheet are press-bonded by a press machine into a single block. The bump penetrates the insulating layer, and the bump and the electrode are electrically connected together. An extra part of the insulating layer pushed out by the bump flows into the groove.

  Recently Added Patents
Vaccine composition against Streptococcus pyogenes
Clock face
Lamp body with integrally molded heat sink
Methods and systems for dynamic spectrum arbitrage
Crystalline solvates of 6-(piperidin-4-yloxy)-2H-isoquinolin-1-one hydrochloride
Implantable device
MiR 204, miR 211, their anti-miRs, and therapeutic uses of same
  Randomly Featured Patents
Timing wheel for toner cartridge with dual springs
Method of controlling robot movement
Press notably for vulcanizing tires
Reconfigurable expert rule processing system
Semiconductor device test probe
Drillable inflatable packer and methods of use
Ink-jet cartridge for ink-jet printers and ink-jet printer using the same
External regulation of gene expression by inducible promoters
Migrating composite seismic response data to produce a representation of a seismic volume