Resources Contact Us Home
Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Image Number 12 for United States Patent #8129219.

In a semiconductor module where a metal sheet, an insulating layer and a circuit element are stacked in a manner that the insulating layer is penetrated with a bump structure, the connection reliability of the bump structure and the circuit element is enhanced. A semiconductor wafer is prepared where a semiconductor substrate having electrodes and protective film on the surface are arranged in a matrix shape. On the surface of the semiconductor substrate, an insulating layer is held between the substrate and a copper sheet, integrally formed with bumps, having grooves in the vicinity of the bumps. The semiconductor substrate, the insulating layer and the copper sheet are press-bonded by a press machine into a single block. The bump penetrates the insulating layer, and the bump and the electrode are electrically connected together. An extra part of the insulating layer pushed out by the bump flows into the groove.

  Recently Added Patents
Multi display device and method of controlling the same
Substrate processing apparatus and display method of substrate processing apparatus
Methods and apparatus for performing multiple photoresist layer development and etching processes
Lamp body with integrally molded heat sink
Cooking device and method of manufacture of the same
Isolated nucleic acid molecule encoding an antibody that reduces GDF-8 activity
Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages
  Randomly Featured Patents
Resin substrate having a resin-metal composite layer and method for manufacturing thereof
Light-sensitive color photographic material having superior color reproducibility
Secure data communication system
Twisting device adapted to simultaneously twist a plurality of electric bar conductors for making a stator or rotor winding for an electric machine and an extractor assembly suitable for coope
Solid polymer binders for thermosetting powder coating compositions, powder coating compositions containing these binders and metal objects coated with these coating compositions
Method and system for performing root cause analysis
Angiogenesis inhibitors
Image forming method
Signal generating apparatus and class-D amplifying apparatus