Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same










Image Number 12 for United States Patent #8129219.

In a semiconductor module where a metal sheet, an insulating layer and a circuit element are stacked in a manner that the insulating layer is penetrated with a bump structure, the connection reliability of the bump structure and the circuit element is enhanced. A semiconductor wafer is prepared where a semiconductor substrate having electrodes and protective film on the surface are arranged in a matrix shape. On the surface of the semiconductor substrate, an insulating layer is held between the substrate and a copper sheet, integrally formed with bumps, having grooves in the vicinity of the bumps. The semiconductor substrate, the insulating layer and the copper sheet are press-bonded by a press machine into a single block. The bump penetrates the insulating layer, and the bump and the electrode are electrically connected together. An extra part of the insulating layer pushed out by the bump flows into the groove.








 
 
  Recently Added Patents
Limited play optical article
Multi-circuit electrohydraulic motor vehicle brake system and method for operating the same
LED assembly driving circuit
Printing system with adjustable aerosol collection
Refrigerator having water feed system
Internal combustion engine
Notifying users of server changes via SSL
  Randomly Featured Patents
Stereoscopic illumination system for retroreflective materials
Returnless fuel delivery system
Method for fabricating semiconductor device
Animated bear
Countercurrent contacting of gas and granular material in panel bed
Collectable sound card having digitally prerecorded natural and/or other sounds stored therein
Liquid and lotion applicator
Hybrid tea rose plant named `Jacolber`
Nonvolatile semiconductor memory
Programmable logic device with programmable word line connections