Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same










Image Number 12 for United States Patent #8129219.

In a semiconductor module where a metal sheet, an insulating layer and a circuit element are stacked in a manner that the insulating layer is penetrated with a bump structure, the connection reliability of the bump structure and the circuit element is enhanced. A semiconductor wafer is prepared where a semiconductor substrate having electrodes and protective film on the surface are arranged in a matrix shape. On the surface of the semiconductor substrate, an insulating layer is held between the substrate and a copper sheet, integrally formed with bumps, having grooves in the vicinity of the bumps. The semiconductor substrate, the insulating layer and the copper sheet are press-bonded by a press machine into a single block. The bump penetrates the insulating layer, and the bump and the electrode are electrically connected together. An extra part of the insulating layer pushed out by the bump flows into the groove.








 
 
  Recently Added Patents
Stable nanoemulsions for ultrasound-mediated drug delivery and imaging
Tomlinson Harashima precoding with additional receiver processing in a multi-user multiple-input multiple-output wireless transmission system
Method and apparatus for using service capability information for user plane location
Methods of saccharification of polysaccharides in plants
Electrical connector
Selecting one of a plurality of print modes based on pixel coverage of a document
Semiconductor device comprising a Fin and method for manufacturing the same
  Randomly Featured Patents
Optical apparatus and method for increasing intensity of multimode laser beams and a printer for printing lenticular images utilizing such laser beams
Smoke detector
Supercharger rotor shaft seal pressure equalization
Reverse concatenated encoding and decoding
Seal with preformed V-shaped packing rings and method
Activation device for activatable indicators used in product labeling
Multilayer circuit board
Handset
SOI MOSFET having amorphized source drain and method of fabrication
Heat and mass transfer additives for improved aqueous absorption fluids