Resources Contact Us Home
Wafer integrated with permanent carrier and method therefor

Image Number 4 for United States Patent #8125073.

A semiconductor device has a wafer for supporting the device and a conductive layer formed over a top surface of the wafer. A carrier wafer is permanently bonded over the conductive layer. Within the wafer and the carrier wafer, an interconnect structure is formed. The interconnect structure includes a first via formed in the wafer that exposes the conductive layer, a second via formed in the carrier wafer that exposes the conductive layer, a first metal layer deposited over the first via, the first metal layer in electrical contact with the conductive layer, and a second metal layer deposited over the second via, the second metal layer in electrical contact with the conductive layer. First and second insulation layers are deposited over the first and second metal layers respectively. The first or second insulation layer has an etched portion to expose a portion of the first or second metal layer.

  Recently Added Patents
Multicyclic compounds and methods of use thereof
Printing apparatus and method of operation of a printing apparatus
Semiconductor fin device and method for forming the same using high tilt angle implant
Reproducible dither-noise injection
Luminescent substrate for liciferase
System and method for dynamic quality-of-service-based billing in a peer-to-peer network
Image forming apparatus to automatically select a communication condition
  Randomly Featured Patents
Chlamydia antigens and corresponding DNA fragments and uses thereof
Reactive formazan dyes and hydrazones
Method and structure for forming relatively dense conductive layers
Method and apparatus for excavating a tunnel or gallery face
Trypsin-like serine protease inhibitors, and their preparation and use
Method and apparatus for constructing efficient codes for Wyner-Ziv video compression systems
Fluid drilling system with flexible drill string and retro jets
Semiconductor device and method for manufacturing the same
Device for manually guided registration for overlaying two datasets
Method of forming a three dimensional integrated circuit structure