Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Wafer integrated with permanent carrier and method therefor










Image Number 4 for United States Patent #8125073.

A semiconductor device has a wafer for supporting the device and a conductive layer formed over a top surface of the wafer. A carrier wafer is permanently bonded over the conductive layer. Within the wafer and the carrier wafer, an interconnect structure is formed. The interconnect structure includes a first via formed in the wafer that exposes the conductive layer, a second via formed in the carrier wafer that exposes the conductive layer, a first metal layer deposited over the first via, the first metal layer in electrical contact with the conductive layer, and a second metal layer deposited over the second via, the second metal layer in electrical contact with the conductive layer. First and second insulation layers are deposited over the first and second metal layers respectively. The first or second insulation layer has an etched portion to expose a portion of the first or second metal layer.








 
 
  Recently Added Patents
Diagnostic data interchange
Single check memory devices and methods
Cell proliferation inhibitor
Battery cell separator
Wafer recycling method
Cooler
Scanning projection apparatus with tangential compensation
  Randomly Featured Patents
Structure in a high voltage path of an ultra-high voltage device for providing ESD protection
Cosmetic applicator
Brush charging device for an image forming apparatus and a method for manufacturing the same
Method of attaching a transfer resistant RFID tag to a surface
Chair
Weatherproof enclosure with a modular structure
Magnetic recording medium
Charging arrangement for electronic accessories
Flower pot cover
Method and system for reducing development time of complex systems utilizing correlation matrices