Resources Contact Us Home
Method and system for the modular design and layout of integrated circuits

Image Number 11 for United States Patent #8122417.

An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.

  Recently Added Patents
System to generate an aggregate interest indication with respect to an information item
Reducing head and tail duplication in stored data
Method and system for detecting and preventing access intrusion in a network
System and methods for providing starter credit card accounts
Semiconductor memory
Dynamic mode transitions for cache instructions
Systems and methods to identify merchants
  Randomly Featured Patents
Keyboard connection apparatus and keyboard input apparatus
Ink ribbon to be used for producing a dry transfer material
Weighing apparatus
Hardcopy lossless data storage and communications for electronic document processing systems
Rogovski coil
Passenger detection system
Method for detecting and determining mediators
Brake gear for a disc brake
Lifetime guaranteed income rider
Educational instruction system