Resources Contact Us Home
Method and system for the modular design and layout of integrated circuits

Image Number 11 for United States Patent #8122417.

An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.

  Recently Added Patents
Network based technique for obtaining operator identifier for mobile devices
Method and apparatus for connecting signal lines of multiple layers to certain contacts while preventing connections with other contacts
Method and apparatus for encoding and decoding video based on first sub-pixel unit and second sub-pixel unit
Network attachment for IMS systems for legacy CS UE with home node B access
Variety corn line NPAA2720
Cathode material for lithium ion secondary battery and lithium ion secondary battery using it
Display window with level of service graphical user interface
  Randomly Featured Patents
Disc player
2-aryl dihydropyrimidine compounds
Equestrian riding pants
Dock seal for building doorway
Method for interferometric radar measurement
Information outputting device
Magnetron for a vault shaped sputtering target having two opposed sidewall magnets
Angle measuring device
Spring-pressurizing unit and fitting-washer
Flexible annuloplasty ring and holder