Resources Contact Us Home
Method and system for the modular design and layout of integrated circuits

Image Number 11 for United States Patent #8122417.

An integrated circuit (IC) and fabrication method thereof is provided that include the steps of specifying a plurality of required tile modules suitable for a particular end application, each of the modular tiles being configured to perform a predetermined function and constructed to have approximately the same length and width dimensions. The modular tiles are used to form the IC in a standard IC fabrication process. In many implementations, physical layout of the IC does not include the step of routing. Capabilities also include configuring the modular tiles to have programmable performance parameters and configuring the modular tiles to cooperate usefully with one another based on a programmable parameter.

  Recently Added Patents
Direct chemical vapor deposition of graphene on dielectric surfaces
Transcription factor
System and method for customized prompting
Optical cable plug-in detection
Landscape post for solar and other light fixtures
Maesa japonica extracts and methods of use
Process for preventing polymerization of cracked volatile products during pyrolysis and gasification
  Randomly Featured Patents
Method for detecting start of electroless plating
Article storage facility
Transient fuel compensation
Tannin mannich adducts for improving corrosion resistance of metals
Disk apparatus
Mower unit having a bevel gear mechanism
Manipulator system
Temperature control of a heated probe
Method for conversion between SIP message and ISUP message and conversion apparatus