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Electronic component mounting structure and method for manufacturing the same










Image Number 14 for United States Patent #8120188.

An electronic component mounting structure includes an electronic component provided with a plurality of electrode terminals, and a mounting substrate provided with connector terminals in positions corresponding to the electrode terminals. An electrode terminal is connected to a connector terminal via a protrusion electrode disposed on the electrode terminal or the connector terminal, and the protrusion electrode includes a conductive filler and a photosensitive resin. The photosensitive resin varies in resin component crosslink density in the height direction of the protrusion electrode.








 
 
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