Resources Contact Us Home
Air gap interconnect structures and methods for forming the same

Image Number 11 for United States Patent #8120179.

A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed on the exposed surfaces of the cavity. A dielectric material layer is formed above the pair of metal lines to encapsulate the cavity. The dielectric metal-diffusion barrier layer prevents diffusion of metal and impurities from one metal line to another metal line and vice versa, thereby preventing electrical shorts between the pair of metal lines.

  Recently Added Patents
Surveillance apparatus and method for wireless mesh network
Profiled rail for advertising/display units
Process for producing a plasma protein-containing medicament with reduced concentration of citrate and metals
Device, system, and method for logging near field communications tag interactions
Methods and apparatus for voltage selection for a MOSFET switch device
Dynamic web page construction based on determination of client device location
Irreversible thermochromic ink compositions
  Randomly Featured Patents
Methods and systems for treating presbyopia
Chemical dispensing apparatus having a pivotal actuator
Portable stand for safely inflating tire and wheel assemblies
Forming an image while milling a work piece
Vacuum insulated travel mug
Therapeutic signal combination
Apparatus for producing fiber reinforced plastic sheet structures
Compositions for reductive aminations utilizing supported tricarboxyborohydride reagents and methods of using the same
Diversity antenna apparatus for portable wireless terminal