Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Air gap interconnect structures and methods for forming the same Image Number 11 for United States Patent #8120179. A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed on the exposed surfaces of the cavity. A dielectric material layer is formed above the pair of metal lines to encapsulate the cavity. The dielectric metal-diffusion barrier layer prevents diffusion of metal and impurities from one metal line to another metal line and vice versa, thereby preventing electrical shorts between the pair of metal lines.       Recently Added Patents Handset mode selection based on user preferences Monolithic IC and MEMS microfabrication process Software model integration scenarios Lignocellulosic biomass saccharification pre-treatment device Compositions and methods for diagnosing, treating, and preventing prostate conditions Composite skin and stringer structure and method for forming the same Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom   Randomly Featured Patents Method and a system for radio transmission Water faucet Computer facilitated product selling system Methods and systems for utilizing cryptographic functions of a cryptographic co-processor Oxadiazolone derivative, production process thereof, and herbicide containing same Solenoid valve Surgical instrument with improvement safety lockout mechanisms Boxing machine for rimmed ammunition Time monitor Aerodynamic component for controlling a landing guide path of an aircraft © 2006-2008 PatentGenius. All Rights Reserved.