Resources Contact Us Home
Air gap interconnect structures and methods for forming the same

Image Number 11 for United States Patent #8120179.

A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed on the exposed surfaces of the cavity. A dielectric material layer is formed above the pair of metal lines to encapsulate the cavity. The dielectric metal-diffusion barrier layer prevents diffusion of metal and impurities from one metal line to another metal line and vice versa, thereby preventing electrical shorts between the pair of metal lines.

  Recently Added Patents
Methods of packaging imager devices and optics modules, and resulting assemblies
Implantable neuro-stimulation electrode with fluid reservoir
Method and apparatus for receiving signals in a MIMO system with multiple channel encoders
Polymer compositions and nonwoven compositions prepared therefrom
Lettuce sister lines PX06514083, PX06514153, PX06514201 and PX06514204
Direct file transfer between subscribers of a communications systems
Relative pose estimation of non-overlapping cameras using the motion of subjects in the camera fields of view
  Randomly Featured Patents
Toner process with metal oxides
Method for the isolation and presumptive diagnosis of Bacillus cereus and tellurite medium therefor
Lead wire and pacemaker using the same
Plastic container with decorative recessed features and associated method and apparatus for manufacture thereof
Method and apparatus for mining and supporting the mine roof
Ergonomic keyboard
Package including syringe and needle
Color filter for transflective type liquid crystal display
Thermal transfer color image forming apparatus with image color and image color density control functions
Apparatus for assembling motorcar body