Resources Contact Us Home
Air gap interconnect structures and methods for forming the same

Image Number 11 for United States Patent #8120179.

A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed on the exposed surfaces of the cavity. A dielectric material layer is formed above the pair of metal lines to encapsulate the cavity. The dielectric metal-diffusion barrier layer prevents diffusion of metal and impurities from one metal line to another metal line and vice versa, thereby preventing electrical shorts between the pair of metal lines.

  Recently Added Patents
Handling errors in a data processing system
Warm air generating apparatus, sheet feeding apparatus, and image forming apparatus including warm air generating apparatus and sheet feeding apparatus
Battery grid
Integrated circuit testing with power collapsed
Remedy for overactive bladder comprising acetic acid anilide derivative as the active ingredient
Display apparatus and control method thereof
Organic light emitting diode device and fabrication method thereof
  Randomly Featured Patents
Retardation compensation element and manufacturing method of the same
Shredding apparatus
Engine with variable compression ratio
Chew article for animals promoting dental/gingival health
Method and system for organic specimen feature identification in ultrasound image
Method and apparatus for producing a sterile milk product
CCD mold package with improved heat radiation structure
Photovoltaic power generation controller and power evaluation method in photovoltaic power generation control
Method for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
Lock set with spindle lock