Resources Contact Us Home
System with semiconductor components having encapsulated through wire interconnects (TWI)

Image Number 14 for United States Patent #8120167.

A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The polymer layer can be formed using a film assisted molding process including the steps of: forming a mold film on tip portions of the bonding members, molding the polymer layer, and then removing the mold film to expose the tip portions of the bonding members. The through wire interconnect provides a multi level interconnect having contacts on opposing sides of the semiconductor substrate.

  Recently Added Patents
Pet grooming brush and vacuum attachment
Secure data exchange for processing requests
Hierarchical binding and lookup of addresses in inter-process communications systems
Method of manufacturing pipe with branch
Multibranched polymer and method for producing the same
Error detection and recovery tool for logical volume management in a data storage system
High frequency vertical spring probe
  Randomly Featured Patents
Roll-stabilized head lifting apparatus and method for a data storage device
Negative electrode current collector for heterogeneous electrochemical capacitor and method of manufacture thereof
Organism destruction by electrohydraulic discharge within a pulsed magnetic field envelope
Safety apparatus for output level-adjustable microwave oven
Methods of forming capacitors and resultant capacitor structures
Personalizing a web page outside of a social networking system with recommendations for content from the social networking system
Electronic part compression bonding apparatus and method
Humeral prosthesis incorporating a sphere
Cooling device for vehicle mounted generator
Approach to avoid buckling BPSG by using an intermediate barrier layer