Resources Contact Us Home
System with semiconductor components having encapsulated through wire interconnects (TWI)

Image Number 14 for United States Patent #8120167.

A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The polymer layer can be formed using a film assisted molding process including the steps of: forming a mold film on tip portions of the bonding members, molding the polymer layer, and then removing the mold film to expose the tip portions of the bonding members. The through wire interconnect provides a multi level interconnect having contacts on opposing sides of the semiconductor substrate.

  Recently Added Patents
Cover panel for frame based door lock
Listing recommendation using generation of a user-specific query in a network-based commerce system
Control device with adjusting pulse width modulation function and the backlight module thereof
Embedded bonding pad for image sensors
Molecular sieve
Transport of multiple asynchronous data streams using higher order modulation
Antibody recognizing turn structure in amyloid .beta.
  Randomly Featured Patents
Lens actuating module
Resol resins prepared using butanol and tri-alkali metal phosphate
Tire bead core and filler construction
Agrobacterium bacteria capable of site-specific recombination
Hydroplane polishing device and method
Video and audio information processing
Communication device
Compositions and methods for the therapy and diagnosis of lung cancer
Oil-water separator
Rechargeable inking member