Resources Contact Us Home
System with semiconductor components having encapsulated through wire interconnects (TWI)

Image Number 14 for United States Patent #8120167.

A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The polymer layer can be formed using a film assisted molding process including the steps of: forming a mold film on tip portions of the bonding members, molding the polymer layer, and then removing the mold film to expose the tip portions of the bonding members. The through wire interconnect provides a multi level interconnect having contacts on opposing sides of the semiconductor substrate.

  Recently Added Patents
Monitoring apparatus for monitoring communication configurations of client devices
Generator with a segmented stator
Flip flop shoe
Commissioning incoming packet switched connections
Changing a system clock rate synchronously
System and method for supporting fibre channel over ethernet communication
Sabatier process and apparatus for controlling exothermic reaction
  Randomly Featured Patents
Extensible sun visor
Printing in a medium
Clutch assembly with wear compensation adjustment
Ground circuit monitor
Integrated olefin processing
Method and apparatus for efficient presentation of high-quality three-dimensional audio including ambient effects
Method of producing ceramic diaphragm structure having convex diaphragm portion and diaphragm structure produced by the same method
Power control circuit for magnetron
Doubly-self-aligned hole-within-a-hole structure in semiconductor fabrication involving a double LOCOS process aligned with sidewall spacers
Hydrogenation process for unsaturated homo and copolymers