Resources Contact Us Home
System with semiconductor components having encapsulated through wire interconnects (TWI)

Image Number 14 for United States Patent #8120167.

A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The polymer layer can be formed using a film assisted molding process including the steps of: forming a mold film on tip portions of the bonding members, molding the polymer layer, and then removing the mold film to expose the tip portions of the bonding members. The through wire interconnect provides a multi level interconnect having contacts on opposing sides of the semiconductor substrate.

  Recently Added Patents
Respirator belt having bumper cushion
Vehicle running control system
Plastic floor-wall transition methods, materials, and apparatus
Three-term predictive adder and/or subtracter
Process for brominating unsaturated organic compounds with removal of quaternary ammonium or quaternary phosphonium monochlorides
Medical imaging probe with rotary encoder
Pattern generation method and pattern generation program
  Randomly Featured Patents
Methods for reducing distal embolization
Debarking knife and method of manufacturing it
Method of making multi-porosity porous plastic strips
Circuit arrangement for a dropout detector
Methods, systems, and formats for data, such as data used in laser projection of fasteners used in manufacturing
Routability based placement for multi-die integrated circuits
Automatic replenishment for a treatment compartment of a photofinishing apparatus
Organosilicon compound, making method, and rubber compounding agent
LHRH analogs
Jaw horse assembly and method