Resources Contact Us Home
System with semiconductor components having encapsulated through wire interconnects (TWI)

Image Number 14 for United States Patent #8120167.

A method for fabricating a semiconductor component with an encapsulated through wire interconnect includes the steps of providing a substrate having a first side, a second side and a substrate contact; forming a via in the substrate contact and the substrate to the second side; placing a wire in the via; forming a first contact on the wire proximate to the first side and a second contact on the wire proximate to the second side; and forming a polymer layer on the first side leaving the first contact exposed. The polymer layer can be formed using a film assisted molding process including the steps of: forming a mold film on tip portions of the bonding members, molding the polymer layer, and then removing the mold film to expose the tip portions of the bonding members. The through wire interconnect provides a multi level interconnect having contacts on opposing sides of the semiconductor substrate.

  Recently Added Patents
Stepped delay control of integrated switches
Toy ball
Methods and apparatus for low power out-of-band communications
Bio-stimulant for improved plant growth and development
Optoelectronic devices and a method for producing the same
Press nut
System and method for data reconfiguration in an optical communication network
  Randomly Featured Patents
Ball bearing cylinder plug and key retention
Herbicidal aryl triazolinones
Vehicle control system
Novel diol monomers and polymers thereof
Diaper with integral wiping cloth and disposal container
Composite mouthguard with palate arch with nonsoftening framework having at least one bridge
Ink ribbon cartridge
Enhancements for TCP performance enhancing proxies