Resources Contact Us Home
Wiring board and method for manufacturing the same

Image Number 15 for United States Patent #8119930.

A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

  Recently Added Patents
Apparatus and method for information processing, program, and recording medium
Method and/or apparatus for navigating mobile robot using virtual sensor
Phase-change memory device having multiple diodes
Methods and apparatus for performing multiple photoresist layer development and etching processes
Wideband multi-channel receiver with fixed-frequency notch filter for interference rejection
Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer
  Randomly Featured Patents
Slow-wave transmission line of the microstrip type and circuit including such a line
Method of molding a pressure vessel locking ring with split rigid reinforcing segments
Method of forming seamed metal tube
Methods and apparatus for particle reduction in MEMS devices
Clean up kit
Solder bonding of electrical components
Aluminium electroplating solution
Set of sphere clusters for use in contemplation and meditation
Self-clocking glyph shape codes