Resources Contact Us Home
Wiring board and method for manufacturing the same

Image Number 12 for United States Patent #8119930.

A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

  Recently Added Patents
Systems and methods to provide report part via a web service
Inhibitors of the mevalonate pathway of Streptococcus pneumoniae
Graphical planner
MOS resistor apparatus and methods
Field-programmable analog array with memristors
High purity diphenyl sulfone, preparation and use thereof for the preparation of a poly(aryletherketone)
Administrable compositions
  Randomly Featured Patents
On-demand and incremental application adaptation
Half-fitting prevention connector and method of producing same
Connector installation tool
Flat screen and mobile telephone with flat screen
Surface acoustic wave resonator and filter using the same with specified distance between an interdigital transducer and reflector
Ink jet printer
Armature assembly method
High-speed pulverizing method and equipment
Method of high speed high power welding
Intrauterine device