Resources Contact Us Home
Wiring board and method for manufacturing the same

Image Number 12 for United States Patent #8119930.

A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

  Recently Added Patents
Rupture resistant system
Reaction medium for detecting and/or identifying bacteria of the Legionella genus
Apparatus and method for information processing, program, and recording medium
Semiconductor device and method of manufacturing the same
Packaging sleeve
System and method for seamlessly increasing download throughput
Polymer-encapsulated colorant nanoparticles
  Randomly Featured Patents
Parting device
Machine for erecting, filling and closing flat-foldable cartons
Passion cross
Focusing electrode and method for field emission displays
Coupling agent
Silver halide photographic material
Auxiliary clip-on for eyeglasses
Wood-reducing apparatus with continual feeder assembly
LTG AlGaAs non-linear optical material and devices fabricated therefrom
Closed-loop rotational control of a brushless dc motor