Resources Contact Us Home
Wiring board and method for manufacturing the same

Image Number 12 for United States Patent #8119930.

A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

  Recently Added Patents
Vehicle display system or projection display for a motor vehicle, and calibration method
Method and system for providing an intelligent visual scrollbar position indicator
Identification wristband
Process for brominating unsaturated organic compounds with removal of quaternary ammonium or quaternary phosphonium monochlorides
Spatially pre-processed target-to-jammer ratio weighted filter and method thereof
Method of operating an electromechanical converter, a controller and a computer program product
Intermediate film for laminated glasses, and laminated glass
  Randomly Featured Patents
Starting device and circuit for starting single phase motors
Tacky allergen trap and filter medium, and method for containing allergens
Polysiloxane-polycarbonate block copolymers based on certain dihydroxydiphenylcycloalkanes
Effect tone generating apparatus
Decision-tree-based symbolic rule induction system for text categorization
Garage door decorative cover
Accelerated signature verification on an elliptic curve
Photographic film conveying device
Robe hook
Solid fuel combustion system for gas turbine engine