Resources Contact Us Home
Wiring board and method for manufacturing the same

Image Number 12 for United States Patent #8119930.

A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

  Recently Added Patents
System and method for discontinuous reception control start time
Battery grid
Polypeptides having beta-glucosidase activity and beta-xylosidase activity and polynucleotides encoding same
Identification of protected content in e-mail messages
Vending machine
Electronic system auto-mute control circuit and control method thereof
Method and apparatus for using virtual machine technology for managing parallel communicating applications
  Randomly Featured Patents
Processes to make apoptosis promoters
DC erase head
Gerbera plant named `Lekgerred`
Feedstock preparation and reactor system for conversion to oxygenates to olefins
Coaxial connectors
Apparatus for sampling gas from a hot dust-filled gas stream
Lighting fixture
Polarization independent semiconductor optical amplifier
Ti-4 protein derived from Triatoma infestans exhibiting activity to inhibit platelet aggregation
Energy-efficient content retrieval in content-centric networks