Resources Contact Us Home
Wiring board and method for manufacturing the same

Image Number 12 for United States Patent #8119930.

A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

  Recently Added Patents
Polymer-encapsulated colorant nanoparticles
User interfaces
Systems and methods for building axes, co-axes and paleo-geographic coordinates related to a stratified geological volume
Solid state lighting circuit and controls
Method for identifying bacteria in a sample
Milk frother
Semiconductor fin device and method for forming the same using high tilt angle implant
  Randomly Featured Patents
Snow board
Turn-off control means for an ac-to-dc electric power converter
Repulsion type circuit breaker control device
Dump facility for cassette sewage tanks
Charging apparatus with removable bell
Advanced renewable energy harvesting
Cryogenic rectification system with thermally integrated argon column
Adjustable implantable heart stimulator and method of use
Grease-lubricated sliding guiding members having a low coefficient of friction and an improved lifetime
Low fusing dental porcelains containing fine-grained leucite