Resources Contact Us Home
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.

  Recently Added Patents
LED package with top and bottom electrodes
Memory interface circuit, memory interface method, and electronic device
Antenna module and wireless communication apparatus
Method, apparatus, and system for synchronizing contents
Solid-state image sensing device and control method of solid-state image sensing device
High-voltage AC light-emitting diode structure
Brushless electric motor or generator in shell construction
  Randomly Featured Patents
Semiconductor component for high voltage
Dragline with improved thrust bearing assembly supporting upper structure
Modular catalyst bed support
Miniature transformer
Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
Methods and apparatus for extracting integer remainders
Method and apparatus for suppressing tones induced by cyclic dynamic element matching (DEM) algorithms
Fire system implemented with power line communications
Method and apparatus for removing artifacts during magnetic resonance imaging
Apparatus and method for channel-transparent multimedia broadcast messaging