Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof










Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.








 
 
  Recently Added Patents
Computerized information and display apparatus
Methods and arrangements in a wireless communications system
Exposure apparatus, exposure method, and method for producing device
Furniture support
System and method of selecting a data detection technique for a MIMO system
Arylalkylamine compound and process for preparing the same
Header for a kennel gate
  Randomly Featured Patents
Process for preparing nitrogen-containing isotropic pitch and nitrogen-containing isotropic pitch
Process for preparation of diethylenetriaminepentaacetic acid derivative, and diethylenetriaminepentaacetic acid derivative
PTC adaptor
Graft fixation device and method
Backlight unit and display device
Intraoral appliance to improve voice production
Thermal transfer impression system
Secure, vehicle key, storage device and associated method
Support stay
Apparatus for distributing subscription and on-demand audio programming