Resources Contact Us Home
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.

  Recently Added Patents
Coated article and method for making the same
Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
Image heating device
Data storage apparatus, memory control apparatus and method for controlling flash memories
Multi-user remote health monitoring system with biometrics support
Aluminum galvanic cell
Method for maintaining a driver-independent braking intervention after a collision
  Randomly Featured Patents
Innersole with shock-absorbing inserts
Return apparatus
Shoe sole
Preparation of styrene from ethylbenzene
Magnetic shield and multitrack magnetic head apparatus using same
Remote controller
Food oven with even heat distribution
Ligation amplification
Printability improvers for molded synthetic resin products
Article and process for creating designs on the surface of concrete