Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof










Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.








 
 
  Recently Added Patents
Medical device arm
Method and apparatus to select a profile of a digital communication line
Registry key federation systems and methods
Toy track intersection component
Automatic adjustment of devices in a home entertainment system
Victim port-based design for test area overhead reduction in multiport latch-based memories
Resist underlayer film forming composition for lithography, containing aromatic fused ring-containing resin
  Randomly Featured Patents
Combination flipbook and pull-up focal header
Frame stand
Methods of producing plastic-coated metallic members
Fuel injection control system for a two-cycle engine
Adjustable track light
Quadrature phase shift keyed/bi-phase shift keyed modulator
Automated information technology error and service request correlation
Database management system and method which monitors action results and adjusts user parameters in response
Collapsible pallet and related products
Electrolytic cells and processes