Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof Image Number 4 for United States Patent #8119447. A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.       Recently Added Patents Scooter-type vehicle Method and system for providing a filter for a router Organic el display panel for reducing resistance of electrode lines Shoe upper Domestic to international collect call blocking Device and method for making a semiconductor device including bonding two bonding partners Multilayer piezoelectric element and injector using the same   Randomly Featured Patents Intraocular lens for implantation into the posterior chamber of a human eye Electronic assemblies without solder having overlapping components Channel estimation in a multicarrier radio receiver Mechanically driven roller vane pump Sheet post-processing apparatus and image forming apparatus Make-up unit with a safety fastener Acoustic scintillation liquid flow measurement Payload deployment from shuttle with linear and angular velocity Method and apparatus for an improved bellows shield in a plasma processing system Outboard marine heat exchanger © 2006-2008 PatentGenius. All Rights Reserved.