Resources Contact Us Home
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.

  Recently Added Patents
UV exposure method for reducing residue in de-taping process
Method and apparatus for predicting object properties and events using similarity-based information retrieval and modeling
Damage resistant antenna
Malicious attack detection and analysis
Vehicle and method for controlling vehicle
Pyridyldiamido transition metal complexes, production and use thereof
Composite filtration membranes and methods of preparation thereof
  Randomly Featured Patents
Method of manufacturing wiring substrate
Detection of wafer fragments in a wafer processing apparatus
Method and apparatus for detecting the presence of subblocks in a reduced-redundancy storage system
Network connector for reduced EMI effects
Lighting system
Memory arbitration system and method having an arbitration packet protocol
Interactivity emulator for broadcast communication
Heavy vehicle tire to draw machinery
Dental handpiece for the polymerization of photosetting compounds or resins, compatible with the power supply of other handpieces
Liquid vapor separator