Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof










Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.








 
 
  Recently Added Patents
Chemically resistant membranes, coatings and films and methods for their preparation
Method of treating a preceramic material
Receiver with feedback continuous-time delta-sigma modulator with current-mode input
Control strategies for a multi-mode drive system
Signal routing dependent on a loading indicator of a mobile node
Method and apparatus for focusing electrical stimulation in the brain during electro-convulsive therapy
Range extension techniques for a wireless local area network
  Randomly Featured Patents
Front jaw for safety ski bindings
Conveyer system having flexible magnetic inner slider for propelling outer member
Method and apparatus for vacuum treatment
Extending multicast applications available on data networks to cell-based wireless networks
Hanger device with decorative covers
Reciprocating sled drive for a flat bed knitting machine
Seal assembly for turbine, bucket/turbine including same, method for sealing interface between rotating and stationary components of a turbine
Housing for flash-bang grenade
Differentiated storage resource provisioning
Trailer with top rail assembly having awning mount