Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof










Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.








 
 
  Recently Added Patents
Polymers
Requirements model comparative analysis method for effort estimation in customizing a network monitoring and control system
Plasmon generator includes three metal layers for thermally-assisted magnetic recording
Method and system for electronic assistance in dispensing pharmaceuticals
Video recording and playing apparatus and its control method
Wafer processing method and system using multi-zone chuck
Storing a location within metadata of visual media
  Randomly Featured Patents
Depletion-mode transistor that eliminates the need to separately set the threshold voltage of the depletion-mode transistor
Spout for squeeze bottle
Drinking glass having a press-molded stem and a base (or pedestal)
Dashboard support
Substituted 2,6-substituted pyridine compounds
Pressure switch
Device for attaching terminal straps and terminal poles to the lugs of a plate group for a storage battery cell
Putter mountable divot replacement tool
Hook tool for swimming pool skimmer
Tapered tray with pre-glued elevating legs