Resources Contact Us Home
Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof

Image Number 4 for United States Patent #8119447.

A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside the recess in the structure; and encapsulating the structure and the semiconductor device in an encapsulation.

  Recently Added Patents
System, method and computer program product for monitoring and controlling network connections from a supervisory operating system
Oxidative coupling of hydrocarbons as heat source
LCD television set capable of external connection with application processor
System and apparatus for control of published content
Push mechanism for efficiently sending aggregated data items to client
Vehicle lamp component
Switchgear and method for operating switchgear
  Randomly Featured Patents
Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of d
Lifting assembly
Electrophotographic plate-making material
Method for simultaneous identification of differentially expressed mRNAs and measurement of relative concentrations
Interconnection routing system
Ultrasonic testing system and ultrasonic testing technique for pipe member
Sealed-type remote pressure-monitoring device and method for fabricating the same
Compounds useful for inhibiting paramyxovirus neuraminidase
Unitary multi-component filter media
Lithium polymer battery and method for producing the same