Resources Contact Us Home
Negative coefficient of thermal expansion particles

Image Number 2 for United States Patent #8119206.

A method of forming a negative coefficient of thermal expansion particle includes flattening a hollow sphere made of a first material, annealing the flattened hollow sphere at a reference temperature above a predetermined maximum use temperature to set a stress minimum of the flattened hollow sphere, and forming a coating made of a second material on the flattened hollow sphere at the reference temperature, the second material having a lower coefficient of thermal expansion than that of the first material, the negative coefficient of thermal expansion particle characterized by volumetric contraction when heated.

  Recently Added Patents
Glycosyltransferase promoter
Electromagnetic bandgap structure and printed circuit board
Cosmetic/dermatological compositions comprising naphthoic acid compounds and polyurethane polymers
System and method for displaying a constant time selection context menu interface
Stacked structure and stacked method for three-dimensional chip
Generating a funding and investment strategy associated with an underfunded pension plan
Method and apparatus for belling plastic pipe
  Randomly Featured Patents
Semiconductor die containing lateral edge shapes and textures
Method for calibrating a SCARA robot
Incorporation of biological molecules into bioactive glasses
One-way ratchet wrench
Blade support and control arrangement for a motor grader
Beam addressed memory system
Movable support for window washers and the like
Battery fuse bus bar assembly
Method of filling contact hole of semiconductor device
Bridged charge transport materials having a central sulfur atom linkage