Resources Contact Us Home
Semiconductor processing parts having apertures with deposited coatings and methods for forming the same

Image Number 8 for United States Patent #8118941.

Holes in semiconductor processing reactor parts are sized to facilitate deposition of protective coatings, such as by chemical vapor deposition at atmospheric pressure. In some embodiments, the holes each have a flow constriction that narrows the holes in one part and that also divides the holes into one or more other portions. In some embodiments, the aspect ratios of the one or more other portions are about 15:1 or less, or about 7:1 or less, and have a cylindrical or conical cross-sectional shape. The holes are coated with a protective coating, such as a silicon carbide coating, by chemical vapor deposition, including chemical vapor deposition at atmospheric pressure.

  Recently Added Patents
Sensor coating
Method for forming ventilation holes in an electrode plate
VGPU: a real time GPU emulator
Coordinated multi-point transmission in a cellular network
Managing job execution
Systems and methods for identifying similar documents
Probe for ultrasound diagnostic apparatus
  Randomly Featured Patents
Non-volatile semiconductor memory device allowing efficient programming operation and erasing operation in short period of time
Telephone handset with base
Self-diagnosis apparatus for vehicle
Golf club grip and glove rain shield
Reduction seat for chamber pots or toilet bowls
Folding electronic device
Method for feeding a coating solution
Package of a semiconductor device with a flexible wiring substrate and method for the same
Polar loop transmitter
Cryogenic gas purification process and apparatus