Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Clamping mechanism for semiconductor device










Image Number 2 for United States Patent #8118940.

A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the C-shaped pickup plate thereon; and a clamp comprising (i) a top ring portion for clamping the substrate by sandwiching a periphery of the substrate between the top ring portion and the susceptor top plate and (ii) a pickup plate supporting portion adapted to support an outer periphery portion of the C-shaped pickup plate, wherein the C-shaped pickup plate is movable between the top ring portion and the pickup plate supporting portion, and the clamp is movable upward together with the C-shaped pickup plate and the susceptor top plate.








 
 
  Recently Added Patents
Encoder that detects positional information of a moving body generating interference fringes that move in opposite directions
Statistical identification of instances during reconciliation process
Semiconductor memory system having ECC circuit and controlling method thereof
Image processing apparatus, image processing method, and program
Taxi cab key chain
Hydrogenolysis of ethyl acetate in alcohol separation processes
Semiconductor apparatus
  Randomly Featured Patents
Fabricating automotive spaceframes using electromagnetic forming or magnetic pulse welding
Shared resource control using a deferred operations list
Vibration correction apparatus and optical device
Preparation of crystalline silicate ZSM-12
Acoustic touch position sensor using a low acoustic loss transparent substrate
Tin compounds for brightness improvement of jack pine ultra
High efficiency class A amplifier
Laminated and bonded structure of plates
Managing emergency response services using mobile communication devices
Retractable needle medical device