Resources Contact Us Home
Clamping mechanism for semiconductor device

Image Number 2 for United States Patent #8118940.

A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the C-shaped pickup plate thereon; and a clamp comprising (i) a top ring portion for clamping the substrate by sandwiching a periphery of the substrate between the top ring portion and the susceptor top plate and (ii) a pickup plate supporting portion adapted to support an outer periphery portion of the C-shaped pickup plate, wherein the C-shaped pickup plate is movable between the top ring portion and the pickup plate supporting portion, and the clamp is movable upward together with the C-shaped pickup plate and the susceptor top plate.

  Recently Added Patents
Database caching utilizing asynchronous log-based replication
Capacity and coverage self-optimization method and device in a mobile network
Method and system for quantifying viewer awareness of advertising images in a video source
UV liquid treatment system
Strap-hook ring
Liquid crystal shutter glasses
Method and apparatus for internet on-line insurance policy service
  Randomly Featured Patents
Echinacea plant named `Jacob Lewis`
Compact laser diode monitor using defined laser momentum vectors to cause emission of a coherent photon in a selected direction
Semiconductor device comprising thin film transistors having a passivation film formed thereon
Method of driving display elements and electronic apparatus using the driving method
Tamper evident valve outlet cap
Image processing apparatus, remote management system, license update method, and computer program product
Betaines as adjuvants to susceptibility testing and antimicrobial therapy
Multiple plane scanning system for data reading applications
Vehicle blind spot detector
Terminal connector with a crimping portion with recesses