Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Clamping mechanism for semiconductor device










Image Number 2 for United States Patent #8118940.

A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the C-shaped pickup plate thereon; and a clamp comprising (i) a top ring portion for clamping the substrate by sandwiching a periphery of the substrate between the top ring portion and the susceptor top plate and (ii) a pickup plate supporting portion adapted to support an outer periphery portion of the C-shaped pickup plate, wherein the C-shaped pickup plate is movable between the top ring portion and the pickup plate supporting portion, and the clamp is movable upward together with the C-shaped pickup plate and the susceptor top plate.








 
 
  Recently Added Patents
Information processing apparatus, non-transitory computer-readable recording medium, and information processing method
Provision of downlink packet access services to user equipment in spread spectrum communication network
Configurable logic cells
Surfcraft fin
Accessing device via communication protocol selection
Luggage wheel housing with wheel
Method to prevent hyper frame number de-synchronization in a wireless communication system
  Randomly Featured Patents
Method of making electrical connections to integrated circuit
Process for producing polyacetylene
Personal or family financial accounting and management system
Compact plasma accelerator
Abrasion resistant pattern
Wick structure of heat pipes
Safety frame
Substrate processing system and substrate processing method
Method and compositions for inhibiting MAGE protein interaction with KAP-1
Techniques for handling service flows in wireless communication systems