Resources Contact Us Home
Clamping mechanism for semiconductor device

Image Number 2 for United States Patent #8118940.

A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the C-shaped pickup plate thereon; and a clamp comprising (i) a top ring portion for clamping the substrate by sandwiching a periphery of the substrate between the top ring portion and the susceptor top plate and (ii) a pickup plate supporting portion adapted to support an outer periphery portion of the C-shaped pickup plate, wherein the C-shaped pickup plate is movable between the top ring portion and the pickup plate supporting portion, and the clamp is movable upward together with the C-shaped pickup plate and the susceptor top plate.

  Recently Added Patents
Efficient location discovery
Concentrating photovoltaic system module with actuator control
Credit flow control scheme in a router with flexible link widths utilizing minimal storage
SIC semiconductor device and method for manufacturing the same
Driving system of display panel having a circuit of a voltage generator and driving method thereof
Systems and methods for vehicle cruise control
Buildable dinnerware
  Randomly Featured Patents
Content propagation for enhanced document retrieval
Channel estimation and channel quality indicator (CQI) measurements for a high-speed downlink GPRS
Litter tray frame
Active parasite power circuit
Method and apparatus for curving a catheter
Method for parting rubber and products formed thereby, and a method of making a blood vessel
Vehicle speed control system
Synchronizing mechanism for clutches
LED lamp