Resources Contact Us Home
Clamping mechanism for semiconductor device

Image Number 2 for United States Patent #8118940.

A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the C-shaped pickup plate thereon; and a clamp comprising (i) a top ring portion for clamping the substrate by sandwiching a periphery of the substrate between the top ring portion and the susceptor top plate and (ii) a pickup plate supporting portion adapted to support an outer periphery portion of the C-shaped pickup plate, wherein the C-shaped pickup plate is movable between the top ring portion and the pickup plate supporting portion, and the clamp is movable upward together with the C-shaped pickup plate and the susceptor top plate.

  Recently Added Patents
Lens module and method for manufacturing thereof
Imidazole derivatives used as TAFIa inhibitors
High density molecular memory storage with read and write capabilities
Actuators and moveable elements with position sensing
Power supply system for a data storage system and a method of controlling a power supply
Metal melting apparatus and method for melting metal
Real-time RSL monitoring in a web-based application
  Randomly Featured Patents
Weight plate
Data error recovery using reduced speed
Background suppression and color adjustment method
Two-wire type wiring case
Service mapping method of enterprise application modeling and development for multi-tier service environments
Use of sclareolide in augmenting or enhancing the organoleptic properties of foodstuffs
Pad structure of liquid crystal display device and fabrication method thereof
Mobile auger elevator with a flanged auger tube
Solid-state laser device
Non-volatile memory with background data latch caching during read operations