Resources Contact Us Home
Clamping mechanism for semiconductor device

Image Number 2 for United States Patent #8118940.

A clamping mechanism for a semiconductor substrate includes: a C-shaped pickup plate; a susceptor top plate having a periphery adapted to receive and support an inner periphery portion of the C-shaped pickup plate thereon; and a clamp comprising (i) a top ring portion for clamping the substrate by sandwiching a periphery of the substrate between the top ring portion and the susceptor top plate and (ii) a pickup plate supporting portion adapted to support an outer periphery portion of the C-shaped pickup plate, wherein the C-shaped pickup plate is movable between the top ring portion and the pickup plate supporting portion, and the clamp is movable upward together with the C-shaped pickup plate and the susceptor top plate.

  Recently Added Patents
Printing system, information processing apparatus, print job processing method, information processing method, program, and storage medium
Shape based similarity of continuous wave doppler images
Preparation process of transition metal boride and uses thereof
Portion of display panel or screen with an icon
Customizing a range of acceptable tape dimensional stability write conditions
Passive charge cord release system for an electric vehicle
Pyrrolidine-1,2-dicarboxamide derivatives
  Randomly Featured Patents
Hour gear structure of a watch
Electrode manufacturing method for rechargeable batteries
Acceleration sensor and magnetic disk device using the same
Zoom system for a microscope and method of operating such a zoom system
Process for forming fine patterns
Line production management system
Solvent systems for polymeric dielectric materials
Interrupting a transition sequence between video sources
Software call control agent
Golf accessory holder