Resources Contact Us Home
Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design

Image Number 2 for United States Patent #8117568.

Methods, apparatus and computer program products provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit; while generating the design of the integrated circuit, using a simplified model to predict at least one physical characteristic of the integrated circuit which results from a CMP processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.

  Recently Added Patents
Power consumption management in a MIMO transceiver and method for use therewith
Method for olympic event hospitality program management
Flood protection apparatus and container data center including the same
Graphical user interfaces and occlusion prevention for fisheye lenses with line segment foci
Data latch circuit and electronic device
Antibodies to OX-2/CD200 and uses thereof
Electronic device with multi-orientation
  Randomly Featured Patents
Light source apparatus
Energy absorbing webbings
Portion of a decorator receptacle
Method of treating soil for controlling dust and for effecting soil stabilization through the application of waste water
Method for esterification of (S)-citronellol using lipase in supercritical carbon dioxide
Amphoteric surface-active agents
Integrated bushing component
Speed governor for motor vehicles
Semiconductor device having a lead including aluminum
Piston and piston ring construction