Resources Contact Us Home
Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design

Image Number 2 for United States Patent #8117568.

Methods, apparatus and computer program products provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit; while generating the design of the integrated circuit, using a simplified model to predict at least one physical characteristic of the integrated circuit which results from a CMP processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.

  Recently Added Patents
System and method for outputting virtual textures in electronic devices
Liposomes with improved drug retention for treatment of cancer
Stacked type semiconductor memory device and chip selection circuit
Automobile body
Image forming apparatus and method
VEGF-specific capture agents, compositions, and methods of using and making
  Randomly Featured Patents
Method and apparatus for chemical deposition
Electronic user interface for electronic mixing of water for residential faucets
High performance communications interface
Method and system for detecting gaps between objects
Semiconductor photonic device having a ZnO film as a buffer layer and method for forming the ZnO film
Gas-turbine engine with detachable combustion chamber
Priority-based management of system load level
Bottle shoulder
Method for determining wavelengths of light incident on a photodetector
Housing for an electric machine with auxiliary ventilation