Resources Contact Us Home
Apparatus, method and computer program product for fast simulation of manufacturing effects during integrated circuit design

Image Number 2 for United States Patent #8117568.

Methods, apparatus and computer program products provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit; while generating the design of the integrated circuit, using a simplified model to predict at least one physical characteristic of the integrated circuit which results from a CMP processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.

  Recently Added Patents
MOS device for eliminating floating body effects and self-heating effects
Integrated analyses of breast and colorectal cancers
DRAM refresh method and system
Process for producing polyols
Video reproducing apparatus and video reproducing method
Interposer having molded low CTE dielectric
Method and device for managing subscriber connection
  Randomly Featured Patents
PWM signal generating circuit
Hand operated cutting tool
Digital video logging system
Snowball throwing device
Thin film magnetic memory device for conducting data write operation by application of a magnetic field
Image forming apparatus having change-over type developing device
Magnetic recording medium, method of manufacturing the same and magnetic recording apparatus
Display device
Semiconductor device with structure restricting flow of unnecessary current therein