Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Interposer for semiconductor package










Image Number 14 for United States Patent #8115292.

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.








 
 
  Recently Added Patents
Low thermal bridge building components
Investment fund for maximizing a risk adjusted expected return while providing a defined minimum income at maturity
Testing a system management program
Gumball machine that dispenses multiple gumballs
Lens for television camera
Variable speed linker
Algorithm of Cu interconnect dummy inserting
  Randomly Featured Patents
Display panel and method for fabricating the same
Controller of internal combustion engine
Fastener for retaining sheet cladding
Method for making vacuum circuit breaker electrodes
Plural compartment carton food tray with improved corner construction
Scalable resources in a virtualized load balancer
Plasma vacuum substrate treatment process and system
Highly purified metal material and sputtering target using the same
Process for preparing an overbased metal-containing detergents
Sapstain control composition and method