Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Interposer for semiconductor package










Image Number 14 for United States Patent #8115292.

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.








 
 
  Recently Added Patents
Image decolorizing device
Systems, computer programs, and methods for controlling costs of a healthcare practice
Digital photographing apparatus and control method for evaluating validity of an auto-focus operation
Fuel cell and a method of manufacturing a fuel cell
Clusterin antisense therapy for treatment of cancer
Methods and systems for identifying and changing resolutions to cause an aspect ratio of a printed image to match an aspect ratio of image data
Wafer level packaging structure with large contact area and preparation method thereof
  Randomly Featured Patents
Self-calibration system for capture verification in pacing devices
Integrated circuit devices having uniform silicide junctions
Amplifier or speaker support combination
Simplified bottom electrode-barrier structure for making a ferroelectric capacitor stacked on a contact plug
Light emitting device and electronic equipment provided with the light emitting device
Turbine blade wear protection system with multilayer shim
Methods and apparatus for destroying snails
Support stand for a computer monitor
Electronic computer
Valve for a gas vessel