Resources Contact Us Home
Interposer for semiconductor package

Image Number 14 for United States Patent #8115292.

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

  Recently Added Patents
Instance management of code in a database
Carrier for developing electrostatic charge image, developer for developing electrostatic charge image, image forming apparatus, and image forming method
Co-crystals of agomelatine, a process for there preparation and pharmaceutical compositions containing them
Liquid crystal display apparatus
Apparatus and method for evaluating an activity distribution, and irradiation system
Arbitration for memory device with commands
  Randomly Featured Patents
Diamond electrode and process for producing it
Fishing lure
Phase change memory device
Damper disk of a rubber-series type
Lockable handle
Method and apparatus compensating disturbance in state control device
Mechanism for automatically positioning clamping frames
Method and device for feeding molten resin, and method for manufacturing molded article by using the fed molten resin
Magnetic testing device for internal surfaces of pipe using a magnetizing means and expandable magnetizable material within the pipe