Resources Contact Us Home
Interposer for semiconductor package

Image Number 14 for United States Patent #8115292.

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

  Recently Added Patents
Polymer-encapsulated colorant nanoparticles
Method for providing information of access point selection
Method and system for remotely testing a wireless device
Method and apparatus for executing load distributed printing
Moving structure and micro-mirror device using the same
Variable speed traffic control system
Reception method and reception apparatus
  Randomly Featured Patents
Multi-pulse HVDC system using auxiliary circuit
Microminiature refrigerator
Immune suppression method employing aryl-substituted naphthyridine and pyridopyrazine derivatives
Polymeric micellar clusters and their uses in formulating drugs
Antimicrobial protein specific to Staphylococcus aureus
Portable and folding toilet transport chair and method of using
Roller door drive adapter method and apparatus
Organic light emitting diode display
Highly adhesive pressure sensitive adhesive compositions and sheets
Automobile and truck wheel