Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Interposer for semiconductor package










Image Number 14 for United States Patent #8115292.

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.








 
 
  Recently Added Patents
1,3-diiodohydantoin compound and production method thereof
Electrowetting display devices with a reflective plate structure
Resuming piecewise calibration of a real-time-clock unit after a measured offset that begins at the next calibration period
Method of interfacing a host operating through a logical address space with a direct file storage medium
Apparatus and method for transferring a data signal propagated along a bidirectional communication path within a data processing apparatus
Cooking tray
Method and system for video parameter analysis and transmission
  Randomly Featured Patents
Position-detecting apparatus
Ventilators
Re-centering mechanism for an input device
Light emitting element, light emitting device, and lighting system
Shoe upper
Image shake suppressing device for camera
Operationally reconfigurable array
Method for automatically controlling the bandwidth of a digital filter and adaptive filter utilizing same
Generation of mask-constrained floating-point addition and subtraction test cases, and method and system therefor
Inbred maize line 413A