Resources Contact Us Home
Interposer for semiconductor package

Image Number 14 for United States Patent #8115292.

An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.

  Recently Added Patents
Methods of fabricating semiconductor device
Human renal disease marker substance
Assigning runtime artifacts to software components
Method for isomerisation of hop alpha-acids using heterogeneous alkaline earth metal based catalysts
Compound semiconductor device and manufacturing method therefor
Light-emitting device package and method of manufacturing the same
Therapeutic rinse in a self-heating package
  Randomly Featured Patents
Pile driving
Spring loop key ring and method and apparatus for making same
Sports bottle
Elastic leash attachment
Diagnostic process
Wheel alignment head and system with advanced power management
Electronic, variable speed engine governor
Method of oxidation using nitric acid
Image projection device for use in slit exposure optical system
Semiconductor mechanical sensor and method of manufacture