Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Interposer for semiconductor package Image Number 14 for United States Patent #8115292. An interposer is presented. The interposer includes an interposer base having first and second surfaces. A redistribution layer is disposed on a first surface of the interposer base. The interposer has at least one interposer pad coupled to the redistribution layer. It also includes at least one interposer contact on the second surface. The interposer contact is electrically coupled to the interposer pad via the redistribution layer. The interposer also includes at least one interposer via through the interposer base for coupling the interposer contact to the redistribution layer. The interposer via includes reflowed conductive material of the interposer contact.       Recently Added Patents Method and apparatus to reduce dielectric discharge in liquid crystal devices driven with high voltages Recording/reproducing device Propane bottle base Atmospheric plasma treatment of tire cords Methods of vaccine administration, new feline caliciviruses, and treatments for immunizing animals against feline paraovirus and feline herpes virus Software model integration scenarios Vehicle driveability control system   Randomly Featured Patents Person's body weight support in furniture assembly Thermally fused thermoplastic honeycomb structures Attaching optical fibers to integrated optic chips Wafer prober Heater element for a tube connecting device Chlorinated hydrocarbon sensor for cone penetrometer Fiber optic chemical sensor Pipe cleaning machine Impact tool cartridge with separate cutting and seating blades Nonionic surfactant type vesicle dispersion © 2006-2008 PatentGenius. All Rights Reserved.