Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reversible top/bottom MEMS package










Image Number 5 for United States Patent #8115283.

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.








 
 
  Recently Added Patents
Fusion of road geometry model information gathered from disparate sources
Lubricating oil compositions
Systems and methods for determining muscle force through dynamic gain optimization of a muscle PID controller for designing a replacement prosthetic joint
Powder for layerwise manufacturing of objects
Systems and methods for providing power and data to lighting devices
Arbitration for memory device with commands
Method and system for electronic distribution of product redemption coupons
  Randomly Featured Patents
Sensing probe for sludge detectors
Medical tool
Water nozzle with drinking guard
Video timing generation
Cell extension in a cellular telephone system
Method of treating obesity by the oral administration of a predigested protein composition
Temperature and voltage independent on-chip oscillator system and method
Organic contaminant separator
Methods of treating pneumocystis carinii pneumonia
Method and system for transmission or reception of FM signals utilizing a DDFS clocked by an RFID PLL