Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reversible top/bottom MEMS package










Image Number 5 for United States Patent #8115283.

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.








 
 
  Recently Added Patents
Actuating device and heating or air conditioning unit
Kiosk-installable printer with duplex path utilized to deliver printed media sheets to lower front exterior of printer
Wrist tag enclosure
Chip package and method for forming the same
Turning spindle unit of multi-tasking machine
Paint producing method and paint producing system
Methods and systems to dynamically manage performance states in a data processing system
  Randomly Featured Patents
Systems and methods for gaussian decomposition of weather radar data for communication
Apparatus for securing a work piece
Welding method of and apparatus for reconditioning hard metal products
Death care merchandise display system
Method and apparatus for assembling oil filter components
Load responsive temperature control arrangement for internal combustion engine
Ignition system for an internal-combustion engine, particularly for use in a chain saw or the like
High speed electrical connector
Two-part electromagnetic radiation shielding device for mounting on a printed circuit board
Communication device