Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reversible top/bottom MEMS package










Image Number 5 for United States Patent #8115283.

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.








 
 
  Recently Added Patents
Braided pull tug pet toy
Adapter plate for use in mounting an audio/visual device or the like to a surface
Signal judgment method, signal judgment apparatus, program, and signal judgment system
Unsupervised document clustering using latent semantic density analysis
Anti-slip strip for vehicle running boards
Method and apparatus for re-routing calls in a packet network during failures
Control system of substrate processing apparatus, collecting unit, substrate processing apparatus and control method of the substrate processing apparatus
  Randomly Featured Patents
Scented pendant for pet collar
Compositions having a combination of immediate release and controlled release characteristics
Writing coverage information to a framebuffer in a computer graphics system
Rotatable playing surface game
Electronic operator interface based controller and device automatic downloads
Shoe outsole
Particle immobilized coatings and uses thereof
Method of mounting a resin-molded member
Adjusting mechanism for fine control ratio in fine control joystick
Piperidine compounds