Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reversible top/bottom MEMS package










Image Number 5 for United States Patent #8115283.

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.








 
 
  Recently Added Patents
Electric washing machine
IC layout parsing for multiple masks
Antibodies to Clostridium difficile toxins
System and method for providing definitions
Image forming apparatus and method of translating virtual memory address into physical memory address
2-aryl-4-quinazolinones and their pharmaceutical compositions
Method of generating integrated circuit model
  Randomly Featured Patents
Golf club head
Combinations of materials to minimize ESR and maximize ESR stability of surface mount valve-metal capacitors after exposure to heat and/or humidity
Optical connector plug
Light emitting device for optical switching
Poly cross-linked phthalocyanine compound and near-infrared absorbing ink composition comprising the same
Apparatus and method for a voice portal
Supercalendar roll with composite cover
Electric food processor
Shrink tunnel and methods relating thereto
Cooling fan controlling apparatus for computer