Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reversible top/bottom MEMS package










Image Number 5 for United States Patent #8115283.

A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.








 
 
  Recently Added Patents
Visibility radio cap and network
Storage system, control method therefor, and program
Porous objects having immobilized encapsulated biomolecules
Automatic portable electronic device configuration
Method and apparatus for providing charging status information to subscriber of communication service
Use of natriuretic peptide for treating heart failure
Device and method incorporating an improved text input mechanism
  Randomly Featured Patents
Magnetoresistive sensor
Multipoint receiving and data processing apparatus
Device for the arrangement, alignment and correctly positioned feed of articles in particular having elongated shape
DTV transmitter and method of coding main and enhanced data in DTV transmitter
Phthalazinone derivatives
Enhanced visual representations of company related data and generation of virtual business cards
System for scribing a visible label
Green fluorescence-emitting material and a fluorescent lamp provided therewith
Synthetic mimics of mammalian cell surface receptors: method and compositions
Gas lighter with safety device