Resources Contact Us Home
Electronic device and lead frame

Image Number 7 for United States Patent #8114709.

A lead frame facilitates the handling, positioning, attachment, and/or continued integrity of multiple dies, without the use of multiple separate parts, such as jumpers. The lead frame includes a number of structures, each of which is attached to at least one lead. At least one receiving surface, arranged to receive a die, is associated with each structure. When dies are disposed on the receiving surfaces, anodes are similarly-oriented. A number of fingers are attached to the lead frame, and one or more electrode contact surfaces are attached to each finger. Each electrode contact surface can be positioned (for example, bent) with respect to one receiving surface, to facilitate electrical connection between the anode of a die and a lead. The lead frame may be used in connection with surface- and through-hole-mountable electronic devices, such as bridge rectifier modules.

  Recently Added Patents
Display for gloves
Base station synchronization for a single frequency network
Pose-variant face recognition using multiscale local descriptors
Apparatus and sensor for adjusting vertical sensor-alignment
Porous objects having immobilized encapsulated biomolecules
Optical writer and image forming apparatus including same
  Randomly Featured Patents
Method for analyzing morpheme using additional information and morpheme analyzer for executing the method
Microprocessor having register dependent immediate decompression
Laser device with piercing tip for transmyocardial revascularization procedures
Separator for a water/steam separating apparatus
Reclosable container closure
Method and system for network management
Split gate type nonvolatile semiconductor memory device, and method of fabricating the same
Dielectric waveguide phase shifter
Overfill protection device