Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of manufacturing semiconductor device and substrate processing apparatus










Image Number 4 for United States Patent #8110491.

A manufacturing method of a semiconductor device of the present invention includes the step of forming an insulating film on a substrate, and the step of forming a high dielectric constant insulating film on the insulating film, and the step of forming a titanium aluminum nitride film on the high dielectric constant insulating film, wherein in the step of forming the titanium aluminum nitride film, formation of an aluminum nitride film and formation of a titanium nitride film are alternately repeated, and at that time, the aluminum nitride film is formed firstly and/or lastly.








 
 
  Recently Added Patents
Wafer-level chip scale package
Interconnecting virtual domains
Clock phase recovery apparatus
Scalable security services for multicast in a router having integrated zone-based firewall
Method and system for fail-safe call survival
Integrated testing circuitry for high-frequency receiver integrated circuits
Optical splitter device
  Randomly Featured Patents
Permanently buoyant balloon
Maleic anhydride adjunct to triphenylbismuthine to improve mechanical properties of hydroxy terminated binders
Removable coil form for superconducting nmr magnets and a method for its use
Four-vaned crown for a solid-phase chemical reaction support
Semiconductor package having encapsulated chip attached to a mounting plate
Cement composition comprising sodium tripolyphosphate and process for forming shaped articles therefrom
Packaged microelectronic devices recessed in support member cavities, and associated methods
Motorcycle lock
Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
Apparatus and methods for clustering multiple independent PCI express hierarchies