Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor chip attach configuration having improved thermal characteristics










Image Number 5 for United States Patent #8102038.

A semiconductor chip 101 with surface 101b free of circuitry assembled on a metal carrier 102 by an attachment layer 103 with thickness 103a. Included in layer 103 are metal bodies 104 and an adhesive polymeric compound 105 between bodies 104. Metal bodies 104 form metal inter-diffusions with carrier 102 and extend from the carrier across thickness 103a, stopping at and contacting second chip surface 101b. The high thermal conductivity of metal bodies 104 greatly increases the thermal conductivity of the attachment layer. The metal bodies may be arrayed in a regularly spaced pattern in x- and y-directions, as well as in enhanced concentrations in locations of thermal hot spots and of high thermomechnical stresses. In the latter application, the metal bodies prevent the growth of microcracks and delamination.








 
 
  Recently Added Patents
LED light
Wrench
Semiconductor memory device and manufacturing method thereof
System and method of detecting and locating intermittent and other faults
Quinoid thiophene organic photoelectric material, preparation method thereof and application thereof
Ventilated vacuum communication structure
Electrode for a plasma torch
  Randomly Featured Patents
Newspaper vending machine
Vehicle with improved luggage and rack assembly
IgA nephropathy testing method and test kit
Textile treatment
Method for controlling hyperproliferative diseases
Calibration circuit for calibrating frequency characteristics of an AC/DC converter
Engine including valve lift mechanism with oil flow control features
Water conservation method and apparatus therefor
Laundry treating appliance with state of dryness based imaging control
Portable x-ray diffractometer