Resources Contact Us Home
Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Image Number 5 for United States Patent #8067253.

An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

  Recently Added Patents
Method of fabricating solid electrolytic capacitor and solid electrolytic capacitor
Video reproducing apparatus and video reproducing method
Horizontal card holder
Efficient paging in a wireless communication system
Herbicide composition having improved effectiveness, method of preparation and use
Online data conversion technique using a sliding window
Synthetic refrigeration oil composition for HFC applications
  Randomly Featured Patents
Hydraulic lash adjuster having a check valve cartridge sub-assembly
Seating unit
Wireless charging device
Valve timing mechanism with eccentric bushing on rocker shaft
Table leg
Low field magnetoresistance of intergranular tunneling in field-aligned chromium dioxide powders
Method and apparatus for pressing and curing resin-impregnated wrappings about coils
Pool ball sorting apparatus
Harvest pan
Process to prepare borozirconate solution and use as cross-linker in hydraulic fracturing fluids