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Integrated circuit with flexible planer leads










Image Number 2 for United States Patent #8058719.

A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress allow direct mounting of the device to a member, and withstand extreme thermal cycling, such as -197.degree. C. to +150.degree. C. such as encountered in space.








 
 
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