Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for planarization of wafer and method for formation of isolation structure in top metal layer










Image Number 11 for United States Patent #8058175.

The invention discloses a planarization method for a wafer having a surface layer with a recess, comprises: forming an etching-resist layer on the surface layer to fill the entire recess; etching the etching-resist layer and the surface layer, till the surface layer outside the recess is flush to or lower than the bottom of the recess, the etching speed of the surface layer being higher than that of the etching-resist layer; removing the etching-resist layer; and etching the surface layer to a predetermined depth. The method can avoid concentric ring recesses on the surface of the wafer resulted from a chemical mechanical polishing (CMP) process in the prior art, and can be used to obtain a wafer surface suitable for optical applications.








 
 
  Recently Added Patents
Circuit for and method of enabling communication of cryptographic data
Systems and methods for dissipating an electric charge while insulating a structure
Digital broadcast receiver and method for processing caption thereof
Wireless communications system, wireless communications apparatus, wireless communications method and computer program for wireless communication
Pharmaceutical dosage form
Shape based similarity of continuous wave doppler images
Refuelable battery-powered electric vehicle
  Randomly Featured Patents
Nonhygroscopic thermally stable aluminum hydroxide
Method for control of synchronous electrical motors
Integrated pressure sensor with double measuring scale and a high full-scale value
Clock phase control with time distribution of phase corrections
Composite endovascular guidewire
Vehicle and method for operating an engine in a vehicle
Circuit including a DC-FM phase locked loop
Benzazole compounds with ESIPT fluorescence
Heat treatment method for reducing polythionic acid stress corrosion cracking
Method and apparatus for external organization path length validation within a public key infrastructure (PKI)