Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for planarization of wafer and method for formation of isolation structure in top metal layer










Image Number 11 for United States Patent #8058175.

The invention discloses a planarization method for a wafer having a surface layer with a recess, comprises: forming an etching-resist layer on the surface layer to fill the entire recess; etching the etching-resist layer and the surface layer, till the surface layer outside the recess is flush to or lower than the bottom of the recess, the etching speed of the surface layer being higher than that of the etching-resist layer; removing the etching-resist layer; and etching the surface layer to a predetermined depth. The method can avoid concentric ring recesses on the surface of the wafer resulted from a chemical mechanical polishing (CMP) process in the prior art, and can be used to obtain a wafer surface suitable for optical applications.








 
 
  Recently Added Patents
Methods for delivering a drug to a hospital patient for short-term use while minimizing long-term use of the drug
Method and device to treat kidney disease
Card format for digital screen and print display
Media stand
Free-flowing emulsion concentrates
Generalized reference signaling scheme for multi-user multiple input, multiple output (MU-MIMO) using arbitrarily precoded reference signals
Non-contact mechanical property determination of drug tablets
  Randomly Featured Patents
Ferroelectric varactor with built-in DC blocks
Method of rapidly increasing internal temperature of a fuel cell stack during starting of fuel cell system
Timing offset tolerant karaoke game
Mobile terminal and method of selecting broadcast mode therein
Vehicle wheel cover retention system and method for producing same
Sensor for vehicular traffic data accumulating systems
Brazing materials
Method for molding lofted material with decorative support panel and garment made
Curling iron
Apparatus for assembling threaded members