Resources Contact Us Home
Method for low temperature bonding and bonded structure

Image Number 8 for United States Patent #8053329.

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO.sub.2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

  Recently Added Patents
Fire detector
Systems and methods for automobile accident claims initiation
Spectral sensor for checking documents of value
Method and apparatus for cutting high quality internal features and contours
Aisle barrier
Semiconductor device and method for manufacturing the same
Voltage regulator structure that is operationally stable for both low and high capacitive loads
  Randomly Featured Patents
Add-on disc assembly for bicycle hub
Portable water driven pump
Lightweight roller guide and tip for fishing rods
Toy clown doll having two faces
Thermally-assisted magnetic recording head including a shield
Preparation of triazoles by organometallic addition to ketones and intermediates therefor
Bicycle pannier mounting system
Constant temperature solar water heater switch
Latch arrangement
Oxygen supply unit having an oxygen generator