Resources Contact Us Home
Method for low temperature bonding and bonded structure

Image Number 8 for United States Patent #8053329.

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO.sub.2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

  Recently Added Patents
Crowd formation based on wireless context information
Method and system for utilizing native ethernet as a virtual memory interconnect
Method of manufacturing semiconductor devices using ion implantation
Method for inhibiting thermal run-away
Sharing networks determined by sharing of items between individuals
Method for producing coated steel sheet
Information storage medium, reproducing method, and recording method
  Randomly Featured Patents
Modular radiation bean analyzer
Digital recording/reproducing apparatus
Window frame profile
Phase control switching device
Three dimensional interlocking puzzles
Gravity assisted directed liquid cooling
Cable modem analysis system and method therefor for an HFC cable network
Disk drive with adaptive channel optimization