Resources Contact Us Home
Method for low temperature bonding and bonded structure

Image Number 8 for United States Patent #8053329.

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO.sub.2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

  Recently Added Patents
Light powered hearing aid
Projection-type video-image display apparatus
Dynamic facsimile transcoding in a unified messaging platform
High-performance AHCI interface
Electrical installation arrangement
Vehicle detection apparatus and method using magnetic sensor
Managing imaging of computing devices
  Randomly Featured Patents
Laser power calibration in an optical disc drive
Curve follower
Method for forming microwires and/or nanowires
Electrode for electric discharge surface treatment, method for manufacturing electrode, and method for storing electrode
Method, computer program and data processing system for navigating in a flow diagram
Apparatus for removal of container carriers
Securing device for intravenous cannula or catheter
Optimized constraint and index maintenance for non updating updates
Rain blanket
Selected CGRP-antagonists, process for preparing them and their use as pharmaceutical compositions