Resources Contact Us Home
Method for low temperature bonding and bonded structure

Image Number 8 for United States Patent #8053329.

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO.sub.2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

  Recently Added Patents
Single-pass Barankin Estimation of scatterer height from SAR data
Microbial fuel cell and method of use
Machine tool with an electrical generator for passive power generation
Secure data entry device
Keypoint descriptor generation by complex wavelet analysis
Fishing apparatus
Brushless motor drive apparatus and drive method
  Randomly Featured Patents
Pneumatic tire having circumferential grooves and oblique grooves
Apparatus and methods for managing malfunctions on a wireless device
Method for reducing nitrogen oxide on the primary side in a two-stage combustion process
Computer system for dynamically scaling busses during operation
Analog/digital converter and program therefor
Driver circuit for use in an electrocoagulation printing apparatus
Wireless communication system for time division duplex
Method of making an abrasive product
On-chip emulator communication for debugging
Support mechanism