Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method for low temperature bonding and bonded structure










Image Number 8 for United States Patent #8053329.

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO.sub.2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.








 
 
  Recently Added Patents
Adjusting dental prostheses based on soft tissue
Method of enhancing corrosion resistance of hollow vessels
Method and system for automatically identifying wireless signal quality of a region
Advanced joint detection in a TD-SCDMA system
Credit flow control scheme in a router with flexible link widths utilizing minimal storage
System and method for organizing, processing and presenting information
System and method for efficient resource management of a signal flow programmed digital signal processor code
  Randomly Featured Patents
Welding control apparatus and method
Electrical distribution system
Rounded top header extrusion for boat windshields
Rotund action figure
Method of forming a colored and oxide film on aluminum and aluminum alloys
Drill bit inserts with interruption in gradient of properties
Enhancing surface-generated fluorescence signal emitted by a sample
Multi-layer board with decoupling function
Automated french press-like quality producing, high volume, automated, electric beverage maker
Photographic material containing a mixture of silver halide emulsions