Resources Contact Us Home
Method for low temperature bonding and bonded structure

Image Number 8 for United States Patent #8053329.

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO.sub.2. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.

  Recently Added Patents
Method for controlling a basic parity node of a non-binary LDPC code decoder, and corresponding basic parity node processor
Voltage measuring apparatus of assembled battery
Semiconductor light-emitting element, method for producing the same, lamp, lighting device, electronic equipment, mechanical device and electrode
Miniature aerosol jet and aerosol jet array
Toy snake
Organic light emitting diode display
Enhancement of LED light extraction with in-situ surface roughening
  Randomly Featured Patents
Electro-optical devices
Handheld device wireless music streaming for gameplay
Split race bearing assemblies
Multiport memory cell having a reduced number of write wordlines
Twin-bulb Christmas light bulb string
Air bag device
Air conditioner
Cloning of complementary DNA encoding maize nitrite reductase
Street address locating aid
Method of and apparatus for laser processing