Resources Contact Us Home
Integrated circuit package having integrated faraday shield

Image Number 4 for United States Patent #8049119.

A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first substrate (110), the first plurality of layers including a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layer includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features. In the packaged IC, the adhesive material (136) electrically couples the first (132) and the second (134) shielding layers.

  Recently Added Patents
Fragrance compounds
Rotation angle detecting device
Playback device, playback method, and computer program
Wound dressings
Buried object detection in GPR images
Light emitted diode
Crystalline form of zofenopril calcium
  Randomly Featured Patents
Apparatus for forming controlled density fibrous pads for diapers and the other absorbent products Swing
Rotary compressor
Lubricating oil compositions
Latch bolt having crank camming for positive bolt positioning
Arching mechanism and method of use
Communication method, management device, and mobile device
1,2,5-oxadiazoles as inhibitors of indoleamine 2,3-dioxygenase
Ram-type blowout preventer and packer therefor