Resources Contact Us Home
Nanoparticle cap layer

Image Number 4 for United States Patent #8039379.

Functionalized nanoparticles are deposited on metal lines inlaid in dielectric to form a metal cap layer that reduces electromigration in the metal line. The functionalized nanoparticles are deposited onto activated metal surfaces, then sintered and annealed to remove the functional agents leaving behind a continuous capping layer. The resulting cap layer is about 1 to 10 nm thick with 30-100% atomic of the nanoparticle material. Various semiconductor processing tools may be adapted for this deposition process without adding footprint in the semiconductor fabrication plant.

  Recently Added Patents
Charge pump circuit and power-supply method for dynamically adjusting output voltage
Organic light-emitting display and method of manufacturing the same
Cascode circuit device with improved reverse recovery characteristic
Method and system for selecting a target with respect to a behavior in a population of communicating entities
Heating pad
Laboratory spatula
Anti-infective agents and uses thereof
  Randomly Featured Patents
Insert assembly for changing temperature of quantity of liquid contained in bottle
Low cost anti-fuse structure
Jeweled trim for a sandal
Storage device having a semiconductor target
DSP interface for packet processing
Process for the reduction of alkylation catalyst deactivation utilizing low silica to alumina ratio catalyst
Bus interface logic system
Semiconductor substrate incorporating a neutron conversion layer
Emulsifiable isocyanate compositions
Hydraulic Machine