Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Nanoparticle cap layer










Image Number 4 for United States Patent #8039379.

Functionalized nanoparticles are deposited on metal lines inlaid in dielectric to form a metal cap layer that reduces electromigration in the metal line. The functionalized nanoparticles are deposited onto activated metal surfaces, then sintered and annealed to remove the functional agents leaving behind a continuous capping layer. The resulting cap layer is about 1 to 10 nm thick with 30-100% atomic of the nanoparticle material. Various semiconductor processing tools may be adapted for this deposition process without adding footprint in the semiconductor fabrication plant.








 
 
  Recently Added Patents
Reducing energy and increasing speed by an instruction substituting subsequent instructions with specific function instruction
System and method for providing definitions
Methods and systems for managing electronic messages
Automated security analysis for federated relationship
Sericin cationic nanoparticles for application in products for hair and dyed hair
Method and system for providing status of a machine
Solid-state image sensing apparatus and electronic apparatus
  Randomly Featured Patents
Integrated circuit having memory with configurable read/write operations and method therefor
Diphenylsiloxane oligomers functionalized at both terminals and methods for the preparation thereof
Method of manufacturing an embedded printed circuit board
Book page holder
Multiple offset crane boom extension
Interlayer dielectric under stress for an integrated circuit
Planishing apparatus and method
Idler roll for printing press drying stage
Cleaning a pressure control function valve
Device to provide for polishing fingernails