Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit package system including wafer level spacer










Image Number 4 for United States Patent #8039365.

An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.








 
 
  Recently Added Patents
Device for installing conducting components in structures
Group of amino substituted benzoyl derivatives and their preparation and their use
Systems and methods for parameter adaptation
Liquid crystal display panel
Amide derivatives, process for preparation thereof and use thereof as insecticide
Systems and methods for a signed magnitude adder in one's complement logic
Apparatus and method for transmitting and receiving data
  Randomly Featured Patents
Multiple-wheel axle support
Implementing dynamic authority to perform tasks on a resource
Container
Programmable logic device input/output architecture with power bus segmentation for multiple I/O standards
Variable speed AC drive control
Device to remove joint from axle of vehicle
Interactive compression with multiple units of compression state information
Bottle opener
Terminator with indicator
Antimicrobial rubber formulations and molded article