Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit package system including wafer level spacer










Image Number 2 for United States Patent #8039365.

An integrated circuit package system that includes providing a wafer level spacer including apertures, which define unit spacers that are interconnected, and configuring the unit spacers to substantially align over devices formed within a substrate.








 
 
  Recently Added Patents
Powder pulverising device
Peer-to-peer, internet protocol telephone system with proxy interface for configuration data
Methods and kits for predicting the responsiveness of hepatocellular carcinoma patients to 5-fluorouracil-based combination chemotherapy
Pressure washer
Nozzle
Method and apparatus for disease diagnosis and screening using extremely low frequency electromagnetic fields
Acceleration based mode switch
  Randomly Featured Patents
Transmitter for tire state monitoring apparatus
Hemiasterlin and geodiamolide TA
Maize variety inbred PH11V0
Plasma generator with field-enhancing electrodes
Lithographic apparatus and device manufacturing method utilizing a multiple dictionary compression method for FPD
Milk frother
Systems and methods for changing the address of an interface
System for locking a mounting ring on a vehicle hub
Safety electrical plug
Portable bridge system